Patents Assigned to UTAC Hong Kong Limited
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Patent number: 9449903Abstract: An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulant encapsulates the wirebonds and the semiconductor die. A heat spreader has a cap, at least a portion of the cap extending inwardly toward and being spaced from the semiconductor die. The encapsulant fills the space between the portion of the cap and the semiconductor die. The heat spreader further has at least one sidewall extending from the cap, the at least one sidewall disposed on the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.Type: GrantFiled: December 17, 2013Date of Patent: September 20, 2016Assignee: UTAC Hong Kong LimitedInventors: Neil McLellan, Ming Wang Sze, Kwok Cheung Tsang, Wing Keung Lam, Wai Kit Tam
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Patent number: 9305889Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.Type: GrantFiled: May 27, 2014Date of Patent: April 5, 2016Assignee: UTAC Hong Kong LimitedInventors: Kirk Powell, John McMillan, Adonis Fung, Serafin P. Pedron, Jr.
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Publication number: 20140367865Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.Type: ApplicationFiled: May 27, 2014Publication date: December 18, 2014Applicant: UTAC Hong Kong LimitedInventors: Kirk POWELL, John McMILLAN, Adonis FUNG, Serafin P. PEDRON, JR.
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Patent number: 8828801Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted to a die-attach area and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die-attach area are all covered with a molding material, with portions of the electrical contacts and die-attach area protruding from a bottom surface of the molding material.Type: GrantFiled: June 12, 2013Date of Patent: September 9, 2014Assignee: UTAC Hong Kong LimitedInventors: John McMillan, Serafin P. Pedron, Jr., Kirk Powell, Adonis Fung
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Publication number: 20140183712Abstract: An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulant encapsulates the wirebonds and the semiconductor die. A heat spreader has a cap, at least a portion of the cap extending inwardly toward and being spaced from the semiconductor die. The encapsulant fills the space between the portion of the cap and the semiconductor die. The heat spreader further has at least one sidewall extending from the cap, the at least one sidewall disposed on the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.Type: ApplicationFiled: December 17, 2013Publication date: July 3, 2014Applicant: UTAC Hong Kong LimitedInventors: Neil McLellan, Ming Wang Sze, Kwok Cheung Tsang, Wing Keung Lam, Wai Kit Tam
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Patent number: 8736037Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.Type: GrantFiled: May 7, 2010Date of Patent: May 27, 2014Assignee: UTAC Hong Kong LimitedInventors: Kirk Powell, John McMillan, Adonis Fung, Serafin P. Pedron, Jr.
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Patent number: 8610262Abstract: An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulant encapsulates the wirebonds and the semiconductor die. A heat spreader has a cap, at least a portion of the cap extending inwardly toward and being spaced from the semiconductor die. The encapsulant fills the space between the portion of the cap and the semiconductor die. The heat spreader further has at least one sidewall extending from the cap, the at least one sidewall disposed on the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.Type: GrantFiled: February 18, 2005Date of Patent: December 17, 2013Assignee: UTAC Hong Kong LimitedInventors: Neil McLellan, Ming Wang Sze, Kwok Cheung Tsang, Wing Keung Lam, Wai Kit Tam
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Patent number: 8486762Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted to a die-attach area and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die-attach area are all covered with a molding material, with portions of the electrical contacts and die-attach area protruding from a bottom surface of the molding material.Type: GrantFiled: March 8, 2010Date of Patent: July 16, 2013Assignee: UTAC Hong Kong LimitedInventors: John McMillan, Serafin P. Pedron, Jr., Kirk Powell, Adonis Fung
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Patent number: 8330270Abstract: An integrated circuit package having a selectively etched leadframe strip defining a die attach pad and a plurality of contact pads, at least one side of the die attach pad having a plurality of spaced apart pad portions; a semiconductor die mounted to the die attach pad and wires bonding the semiconductor die to respective ones of the contact pads; a first surface of the leadframe strip, including the semiconductor die and wire bonds, encapsulated in a molding material such that at least one surface of the leadframe strip is exposed, and wherein solder paste is disposed on said contact pads and said at least one side of said die attach pad.Type: GrantFiled: December 9, 2004Date of Patent: December 11, 2012Assignee: UTAC Hong Kong LimitedInventors: Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan, Neil McLellan
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Patent number: 7858443Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.Type: GrantFiled: March 9, 2009Date of Patent: December 28, 2010Assignee: UTAC Hong Kong LimitedInventors: Kirk Powell, John McMillan, Adonis Fung, Serafin Pedron, Jr.