Abstract: A method of fabricating a semiconductor package structure is provided that includes: providing a chip having an active surface and a plurality of conductive bumps formed on the active surface, and a base substrate having an underfill layer formed on a surface thereof; attaching the active surface of the chip to the underfill layer, such that the conductive bumps are embedded in the underfill layer; removing the base substrate to expose the underfill layer; and attaching the chip to a package substrate via the underfill layer, such that the chip is electrically connected to the package substrate by the conductive bumps. Since the underfill layer is attached to the active surface of the chip first, and the underfill layer is provided on the package substrate, performing a soldering process is not needed, material cost is decreased, and the fabrication process is simplified.

Abstract: A semiconductor device and a method of manufacturing the same are disclosed. The method is carried out by forming solder pads on a substrate by wet etching, flipping a semiconductor chip having a plurality of connection bumps formed on an active surface of the semiconductor chip for the connection bumps to be mounted by compression on the solder pads of the substrate correspondingly, at a temperature of the compression between the connection bumps and the solder pads lower than the melting points of the solder pads and the connection bumps, so as to allow the semiconductor chip to be engaged with and electrically connected to the substrate through the connection bumps and the solder pads, thereby enhancing the bonding strength of the solder pads and the connection bumps and increasing the fabrication reliability.

Abstract: A multi-substrate region-based package and a method for fabricating the same are provided. An active surface of a chip is divided into a plurality of functional regions, and each of the functional regions is electrically connected to a corresponding substrate via bonding wires. Each of the functional regions has a separate system, and the circuit layout thereof is not limited by the substrate or other systems but can be flexibly and independently designed, thereby allowing the package to be made smaller and thinner. Each set of the functional region and its corresponding substrate functions as an independent unit, such that the substrates are not affected by each other, thereby providing good compatibility, improved reliability and reduced packaging area.

Abstract: A memory card and method for fabricating the same are disclosed, which includes mounting and electrically connecting at least a chip to a circuit board unit having a predefined shape of a memory card; attaching a thin film to the surface of the circuit board unit opposed to the surface with the chip mounted thereon; covering the circuit board unit and the thin film by a mold so as to form a mold cavity having same shape as the circuit board unit but bigger size; filling a packaging material in the mold cavity so as to form an encapsulant encapsulating the chip and outer sides of the circuit board unit, thus integrally forming a memory card having the predefined shape. The present invention eliminates the need to perform a shape cutting process by using water jet or laser as in the prior art, thus reducing the fabricating cost and improving the fabricating yield.

Abstract: A memory card and method for fabricating the same are disclosed, which includes mounting and electrically connecting at least a chip to a circuit board unit having a predefined shape of a memory card; attaching a thin film to the surface of the circuit board unit opposed to the surface with the chip mounted thereon; covering the circuit board unit and the thin film by a mold so as to form a mold cavity having same shape as the circuit board unit but bigger size; filling a packaging material in the mold cavity so as to form an encapsulant encapsulating the chip and outer sides of the circuit board unit, thus integrally forming a memory card having the predefined shape. The present invention eliminates the need to perform a shape cutting process by using water jet or laser as in the prior art, thus reducing the fabricating cost and improving the fabricating yield.

Abstract: A fabrication method of semiconductor device includes providing a substrate which has a plurality of electrical connection pads and is covered with an insulative layer, wherein the insulative layer has an opening formed for exposing the electrical connection pads; forming a filling material on the insulative layer of the substrate and compressing a semiconductor chip to the substrate through a plurality of bumps, the bumps electrically connecting the electrical connection pads and the filling material filling spacing between the semiconductor chip and the substrate so as to form a filling layer. By replacing the conventional underfilling process with the preprinting process of the filling material, the fabrication cost of the semiconductor device is reduced and the fabrication process is simplified.

Abstract: A semiconductor wafer with an adhesive protection layer includes: a wafer body having a first surface and an opposing second surface; a plurality of electrical connection pads formed on the second surface of the wafer body; and the adhesive protection layer formed on the second surface of the wafer body and the plurality of electrical connection pads, wherein the protection layer is made of a material including a photosensitive adhesive, a thermal-setting adhesive and a dielectric material. The protection layer not only isolates circuits on the wafer surface from external moisture and contaminant, but also can be patterned and is adhesive, such that the wafer can be mounted to a circuit substrate in a subsequent process by the protection layer, without having to apply an additional adhesive on the wafer, thereby greatly simplifying the wafer-substrate attachment procedure during package fabrication processes.

Abstract: A semiconductor device and a method of manufacturing the same are disclosed. The method is carried out by forming solder pads on a substrate by wet etching, flipping a semiconductor chip having a plurality of connection bumps formed on an active surface of the semiconductor chip for the connection bumps to be mounted by compression on the solder pads of the substrate correspondingly, at a temperature of the compression between the connection bumps and the solder pads lower than the melting points of the solder pads and the connection bumps, so as to allow the semiconductor chip to be engaged with and electrically connected to the substrate through the connection bumps and the solder pads, thereby enhancing the bonding strength of the solder pads and the connection bumps and increasing the fabrication reliability.

Abstract: A fabrication method of semiconductor device includes providing a substrate which has a plurality of electrical connection pads and is covered with an insulative layer, wherein the insulative layer has an opening formed for exposing the electrical connection pads; forming a filling material on the insulative layer of the substrate and compressing a semiconductor chip to the substrate through a plurality of bumps, the bumps electrically connecting the electrical connection pads and the filling material filling spacing between the semiconductor chip and the substrate so as to form a filling layer. By replacing the conventional underfilling process with the preprinting process of the filling material, the fabrication cost of the semiconductor device is reduced and the fabrication process is simplified.

Abstract: A multi-substrate region-based package and a method for fabricating the same are provided. An active surface of a chip is divided into a plurality of functional regions, and each of the functional regions is electrically connected to a corresponding substrate via bonding wires. Each of the functional regions has a separate system, and the circuit layout thereof is not limited by the substrate or other systems but can be flexibly and independently designed, thereby allowing the package to be made smaller and thinner. Each set of the functional region and its corresponding substrate functions as an independent unit, such that the substrates are not affected by each other, thereby providing good compatibility, improved reliability and reduced packaging area.