Patents Assigned to Uthe Technology, Inc.
  • Lead bonding method and apparatus
    Patent number: 3934108
    Abstract: A segment of electrically conductive wire is extended through a collet in a capillary tool and is mechanically bonded at one extended portion to a circuit point. Thereafter, an electric current having a decreasing ramp-shaped waveform is applied to the portion of the wire between the bonded circuit point and the collet to resistively heat the wire until it ruptures and forms integral balls on the ends of the wire at the rupture.
    Type: Grant
    Filed: September 16, 1974
    Date of Patent: January 20, 1976
    Assignee: Uthe Technology, Inc.
    Inventor: Norman A. Howard