Patents Assigned to UWIN NANOTECH CO., LTD.
  • Patent number: 11180826
    Abstract: The present invention provides an additive for tin stripping, comprising 0.1 to 20 wt % of copper corrosion inhibitor and 0.1 to 20 wt % of nickel corrosion inhibitor; wherein said weight percentage is based on the total weight of said additive. The present additive can be used with nitric acid conventionally used for metal-stripping for not only reducing the usage of nitric acid but also improving the efficiency of tin stripping. The present invention also provides a method for Tin recycle and a reaction tank for metal recycle. Both of them are favorable for satisfying the needs of metal recycle (especially, tin recycle) in the field.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: November 23, 2021
    Assignee: UWIN NANOTECH CO., LTD.
    Inventor: Ching-Hsiang Hsu
  • Publication number: 20190203319
    Abstract: The present invention provides an additive for tin stripping, comprising 0.1 to 20 wt % of copper corrosion inhibitor and 0.1 to 20 wt % of nickel corrosion inhibitor; wherein said weight percentage is based on the total weight of said additive. The present additive can be used with nitric acid conventionally used for metal-stripping for not only reducing the usage of nitric acid but also improving the efficiency of tin stripping. The present invention also provides a method for Tin recycle and a reaction tank for metal recycle. Both of them are favorable for satisfying the needs of metal recycle (especially, tin recycle) in the field.
    Type: Application
    Filed: March 6, 2019
    Publication date: July 4, 2019
    Applicant: UWin Nanotech. Co., Ltd.
    Inventor: CHING-HSIANG HSU
  • Patent number: 9518327
    Abstract: The present invention provides a metal stripping additive, composition containing the same, and method for stripping metal by using the composition. The metal stripping additive comprises a phosphate, a carbonate, and a component selected from at least one of citric acid or a derivative thereof, oxalate or a derivative thereof, malate or a derivative thereof. The metal stripping additive is used with nitric acid as the metal stripping composition of the present invention. The present method has advantages of being capable of stripping various metals, low corrosion, low toxicity, and being applicable under ambient temperature.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: December 13, 2016
    Assignee: UWIN NANOTECH, CO., LTD.
    Inventor: Ching-Hsiang Hsu
  • Publication number: 20160102408
    Abstract: The present invention provides a metal stripping additive, composition containing the same, and method for stripping metal by using the composition. The metal stripping additive comprises a phosphate, a carbonate, and a component selected from at least one of citric acid or a derivative thereof, oxalate or a derivative thereof, malate or a derivative thereof. The metal stripping additive is used with nitric acid as the metal stripping composition of the present invention. The present method has advantages of being capable of stripping various metals, low corrosion, low toxicity, and being applicable under ambient temperature.
    Type: Application
    Filed: December 17, 2015
    Publication date: April 14, 2016
    Applicant: UWin Nanotech. Co., Ltd.
    Inventor: CHING-HSIANG HSU
  • Publication number: 20150376735
    Abstract: The present invention provides an additive for tin stripping, comprising 0.1 to 20 wt % of copper corrosion inhibitor and 0.1 to 20 wt % of nickel corrosion inhibitor; wherein said weight percentage is based on the total weight of said additive. The present additive can be used with nitric acid conventionally used for metal-stripping for not only reducing the usage of nitric acid but also improving the efficiency of tin stripping. The present invention also provides a method for Tin recycle and a reaction tank for metal recycle. Both of them are favorable for satisfying the needs of metal recycle (especially, tin recycle) in the field.
    Type: Application
    Filed: May 1, 2015
    Publication date: December 31, 2015
    Applicant: UWin Nanotech. Co., Ltd.
    Inventor: CHING-HSIANG HSU
  • Patent number: 9090985
    Abstract: The invention provides a stripping gold component which could remove gold from substrate, comprising: a stripping gold chemical compound; and a assistant conductive compound wherein said stripping gold chemical compound bonds with gold to form covalent bond to strip gold from said substrate, said assistant conductive chemical compound helps the electric conduction and decreases the voltage, said substrate would not be damaged after stripping gold from said substrate, and the stripping gold component is cyanide free.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: July 28, 2015
    Assignee: UWIN NANOTECH CO., LTD.
    Inventor: Ching-Hsiang Hsu
  • Publication number: 20140243249
    Abstract: The present invention provides a metal stripping additive, composition containing the same, and method for stripping metal by using the composition. The metal stripping additive comprises a phosphate, a carbonate, and a component selected from at least one of citric acid or a derivative thereof, oxalate or a derivative thereof, malate or a derivative thereof. The metal stripping additive is used with nitric acid as the metal stripping composition of the present invention. The present method has advantages of being capable of stripping various metals, low corrosion, low toxicity, and being applicable under ambient temperature.
    Type: Application
    Filed: August 2, 2013
    Publication date: August 28, 2014
    Applicant: Uwin Nanotech. Co., Ltd.
    Inventor: CHING-HSIANG HSU
  • Publication number: 20120292201
    Abstract: The invention provides a stripping gold component which could remove gold from substrate, comprising: a stripping gold chemical compound; and a assistant conductive compound wherein said stripping gold chemical compound bonds with gold to form covalent bond to strip gold from said substrate, said assistant conductive chemical compound helps the electric conduction and decreases the voltage, said substrate would not be damaged after stripping gold from said substrate, and the stripping gold component is cyanide free.
    Type: Application
    Filed: April 27, 2012
    Publication date: November 22, 2012
    Applicant: UWIN NANOTECH CO., LTD.
    Inventor: Ching-Hsiang Hsu