Patents Assigned to UWIN NANOTECH CO., LTD.
-
Patent number: 11180826Abstract: The present invention provides an additive for tin stripping, comprising 0.1 to 20 wt % of copper corrosion inhibitor and 0.1 to 20 wt % of nickel corrosion inhibitor; wherein said weight percentage is based on the total weight of said additive. The present additive can be used with nitric acid conventionally used for metal-stripping for not only reducing the usage of nitric acid but also improving the efficiency of tin stripping. The present invention also provides a method for Tin recycle and a reaction tank for metal recycle. Both of them are favorable for satisfying the needs of metal recycle (especially, tin recycle) in the field.Type: GrantFiled: March 6, 2019Date of Patent: November 23, 2021Assignee: UWIN NANOTECH CO., LTD.Inventor: Ching-Hsiang Hsu
-
Publication number: 20190203319Abstract: The present invention provides an additive for tin stripping, comprising 0.1 to 20 wt % of copper corrosion inhibitor and 0.1 to 20 wt % of nickel corrosion inhibitor; wherein said weight percentage is based on the total weight of said additive. The present additive can be used with nitric acid conventionally used for metal-stripping for not only reducing the usage of nitric acid but also improving the efficiency of tin stripping. The present invention also provides a method for Tin recycle and a reaction tank for metal recycle. Both of them are favorable for satisfying the needs of metal recycle (especially, tin recycle) in the field.Type: ApplicationFiled: March 6, 2019Publication date: July 4, 2019Applicant: UWin Nanotech. Co., Ltd.Inventor: CHING-HSIANG HSU
-
Patent number: 9518327Abstract: The present invention provides a metal stripping additive, composition containing the same, and method for stripping metal by using the composition. The metal stripping additive comprises a phosphate, a carbonate, and a component selected from at least one of citric acid or a derivative thereof, oxalate or a derivative thereof, malate or a derivative thereof. The metal stripping additive is used with nitric acid as the metal stripping composition of the present invention. The present method has advantages of being capable of stripping various metals, low corrosion, low toxicity, and being applicable under ambient temperature.Type: GrantFiled: December 17, 2015Date of Patent: December 13, 2016Assignee: UWIN NANOTECH, CO., LTD.Inventor: Ching-Hsiang Hsu
-
Publication number: 20160102408Abstract: The present invention provides a metal stripping additive, composition containing the same, and method for stripping metal by using the composition. The metal stripping additive comprises a phosphate, a carbonate, and a component selected from at least one of citric acid or a derivative thereof, oxalate or a derivative thereof, malate or a derivative thereof. The metal stripping additive is used with nitric acid as the metal stripping composition of the present invention. The present method has advantages of being capable of stripping various metals, low corrosion, low toxicity, and being applicable under ambient temperature.Type: ApplicationFiled: December 17, 2015Publication date: April 14, 2016Applicant: UWin Nanotech. Co., Ltd.Inventor: CHING-HSIANG HSU
-
Publication number: 20150376735Abstract: The present invention provides an additive for tin stripping, comprising 0.1 to 20 wt % of copper corrosion inhibitor and 0.1 to 20 wt % of nickel corrosion inhibitor; wherein said weight percentage is based on the total weight of said additive. The present additive can be used with nitric acid conventionally used for metal-stripping for not only reducing the usage of nitric acid but also improving the efficiency of tin stripping. The present invention also provides a method for Tin recycle and a reaction tank for metal recycle. Both of them are favorable for satisfying the needs of metal recycle (especially, tin recycle) in the field.Type: ApplicationFiled: May 1, 2015Publication date: December 31, 2015Applicant: UWin Nanotech. Co., Ltd.Inventor: CHING-HSIANG HSU
-
Patent number: 9090985Abstract: The invention provides a stripping gold component which could remove gold from substrate, comprising: a stripping gold chemical compound; and a assistant conductive compound wherein said stripping gold chemical compound bonds with gold to form covalent bond to strip gold from said substrate, said assistant conductive chemical compound helps the electric conduction and decreases the voltage, said substrate would not be damaged after stripping gold from said substrate, and the stripping gold component is cyanide free.Type: GrantFiled: April 27, 2012Date of Patent: July 28, 2015Assignee: UWIN NANOTECH CO., LTD.Inventor: Ching-Hsiang Hsu
-
Publication number: 20140243249Abstract: The present invention provides a metal stripping additive, composition containing the same, and method for stripping metal by using the composition. The metal stripping additive comprises a phosphate, a carbonate, and a component selected from at least one of citric acid or a derivative thereof, oxalate or a derivative thereof, malate or a derivative thereof. The metal stripping additive is used with nitric acid as the metal stripping composition of the present invention. The present method has advantages of being capable of stripping various metals, low corrosion, low toxicity, and being applicable under ambient temperature.Type: ApplicationFiled: August 2, 2013Publication date: August 28, 2014Applicant: Uwin Nanotech. Co., Ltd.Inventor: CHING-HSIANG HSU
-
Publication number: 20120292201Abstract: The invention provides a stripping gold component which could remove gold from substrate, comprising: a stripping gold chemical compound; and a assistant conductive compound wherein said stripping gold chemical compound bonds with gold to form covalent bond to strip gold from said substrate, said assistant conductive chemical compound helps the electric conduction and decreases the voltage, said substrate would not be damaged after stripping gold from said substrate, and the stripping gold component is cyanide free.Type: ApplicationFiled: April 27, 2012Publication date: November 22, 2012Applicant: UWIN NANOTECH CO., LTD.Inventor: Ching-Hsiang Hsu