Patents Assigned to UYEMURA INTERNATIONAL CORPORATION
  • Patent number: 9650719
    Abstract: A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (?m) and 5 ?m. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: May 16, 2017
    Assignee: UYEMURA INTERNATIONAL CORPORATION
    Inventor: Jon E. Bengston
  • Patent number: 9603258
    Abstract: A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (?m) and 5 ?m. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: March 21, 2017
    Assignee: UYEMURA INTERNATIONAL CORPORATION
    Inventor: Jon E. Bengston