Abstract: A process for forming sub-lithographic features in an integrated circuit is disclosed herein. A process for enhancing the etch trimmability and the etch stability of features patterned on a photoresist layer is also disclosed herein. The process includes curing a photoresist layer after patterning and development but before an etch process is performed thereon. By controlling the formation of the cured portions of the features patterned on the photoresist layer, the features can be trimmed to sub-lithographic critical dimensions without pattern deformation or occurrence of other failure mechanisms.