Abstract: A magnetically enhanced sputtering device including first magnet means for establishing a magnetic field where the lines of force thereof extend over and may pass through the cathode sputtering surface at one predetermined area thereof. The first magnet means may be disposed on the side of the cathode opposite the sputtering surface where the flux therein may be substantially parallel to or inclined with respect to the sputtering surface. Second magnet means are preferably included in the path of the flux projected from the first magnet means so that the second magnet means not only contributes to the magnetic field formed over the sputtering surface, but it also blocks flux from extending below the first magnet means to thereby enhance the strength of the field formed over the first magnet means. Various embodiments are disclosed for effecting the foregoing.

Abstract: In a planar magnetron sputtering device including a cathode of target material having a planar sputtering surface, at least a portion of which is disposed about a center line perpendicular to said surface, an anode adapted for establishing an accelerating electric field between the anode and cathode, and magnetic means for establishing a magnetic field adjacent the planar sputtering surface of the cathode for lengthening the path traveled by electrons removed from said cathode, and wherein the lines of force of the magnetic field extend over the sputtering surface of said cathode and pass through the cathode in the vicinity of the center line, the improvement where the magnetic means includes first magnet means for causing a majority of the magnetic lines of force to pass through the cathode in the vicinity of the center line at angles of 45.degree.

Abstract: A planar magnetron sputtering device where the magnetic lines of force pass through the center of the planar cathode at angles of 45.degree. or less with respect to the planar surface of the cathode to thereby promote uniformity of cathode erosion. The magnetic structure may comprise mangetic tape stacked or rolled to form a solid, flat coil parallel to the cathode where at least some of the tape is tipped or slanted with respect to the cathode. Other magnetic structures are also disclosed which promote uniformity of cathode erosion.