Patents Assigned to Valo, Inc.
  • Patent number: 7006500
    Abstract: Methods, apparatuses and systems facilitating the aggregation or bonding of communications paths into a higher-bandwidth, logical communications path. Embodiments of the present invention can be applied to bond different physical links (e.g., xDSL over twisted pairs), different channels on the same physical line, or even different channels or frequencies in a wireless communications network. The present invention further provides methods, apparatuses and systems facilitating the re-sequencing of data flows transmitted across bonded communications paths. In one embodiment, the re-sequencing methodology of the present invention adapts to the transmission delays (both absolute and relative) across the bonded communications path.
    Type: Grant
    Filed: December 30, 2002
    Date of Patent: February 28, 2006
    Assignee: Valo, Inc.
    Inventors: Soren Bo Pedersen, Radimir Shilshtut, Danny Thom, Sina Soltani, Manish Lohani
  • Patent number: 6879590
    Abstract: Methods, apparatuses and systems facilitating the aggregation or bonding of physical communications links into higher-bandwidth logical links. A novel link bonding and encapsulation protocol scheme that optimizes the efficiency of data transfer across the physical links, while still allowing for desired Quality of Service (QoS) levels to high-priority traffic, such as voice data, with low delay requirements. Data streams are divided and concurrently transported over multiple physical links that are aggregated or bonded together to form one logical link. At the receive end, the original cell streams are recovered from the bonded logical links. In one embodiment, the physical links are xDSL links transmitting and receiving signals via conventional copper twisted-pair cabling.
    Type: Grant
    Filed: July 24, 2002
    Date of Patent: April 12, 2005
    Assignee: Valo, Inc.
    Inventors: Soren Bo Pedersen, Radimir Shilshtut, Danny Thom, Sina Soltani, Lauren Trevor May