Abstract: Two sided printed circuit boards with very small rings surrounding the plated though holes can be produces by starting with a through-plated copper laminate, and coating it with a liquid negative electrodeposition photo-resist. The coated photo-resist is exposed to light through a mask set up so that the light does not shine on the through-platings. The non-crosslinked photo-resist is subsequently removed. A metal or a metal alloy resist is laid down by electrodeposition on those surfaces from which the non-crosslinked photo-resist has been removed. Finally, the crosslinked photoresist material is removed and the exposed copper laminate is treated with a copper-etching solution to completely remove the copper surface that has been uncovered.

Abstract: The invention relates to a method for producing sequentially built-up printed circuit boards having a disparate number of conduction planes on both sides of the laminate core, which method comprises the following method steps: (A) coating both sides of a printed circuit board having conductor structures on only one side with a dielectric comprising a photopolymer or a thermally curable polymer; (B) structuring the plating holes (vias) on the side having the conductor structures by exposing the dielectric comprising a photopolymer to light and then developing with a solvent or by laser-drilling the plating holes (vias) into the dielectric comprising a thermally cured polymer; (C) depositing a copper layer on both sides of the board so obtained; (D) forming conductor structures on the front and completely etching away on the rear, if further asymmetric build-up is to be carried out, or on both sides of the printed circuit board if there is to be no further build-up or if further build-up is to be carried ou

Abstract: A curable epoxy resin composition comprising (a) a cycloaliphatic epoxy resin that is liquid at RT and, suspended therein, a core/shell polymer, (b) a polycarboxylic anhydride and (c) fillers, wherein the composition is flame-retardant because two different fillers (c1) and (c2) are present, the nature of filler (c1) being such that, starting at RT, it is able to release water as the temperature rises, the total proportion of fillers (c1) and (c2) is from 58 to 73% by weight, based on the total amount of components (a), (b), (c1) and (c2), and the ratio by weight of the fillers (c1):(c2) is from 1:3 to 1:1, is suitable as a casting resin, especially in the impregnation of electrical coils and in the production of electrical components, such as air-cooled transformers, bushings, insulators, switches, sensors, converters and cable end seals.

Abstract: Powder coating compositions comprise a binder selected from carboxyl-group-containing polyesters, carboxyl-group-containing poly(meth)acrylates and mixtures of the said substances, and one or more novel epoxy compounds.

Abstract: The present invention relates to compositions comprising A composition comprising (a) a resin containing a polyepoxide and a polyisocyanate, and (b) a treated filler which is either a silane-treated filler or an atomised filler, The compositions are suitable for the fabrication of high performance resin molds which can then be used for various molding methods such as injection molding, press molding, vacuum molding, high pressure molding or foaming molding.

Abstract: A composition comprising (a) an epoxy resin having, on average, more than one 1,2-epoxy group per molecule, (b) a polyol as epoxy resin curing agent and (c) a solid microgel-amine adduct as accelerator has high latency, good storage stability and a wide processing window.

Abstract: An adhesive composition comprising (a) an epoxy resin having a substantially linear structure, (b) an amine hardener, and (c) a non-ionic surfactant, is suitable for adhering low energy (composite) surfaces to rigid metal or non-metal composite surfaces/parts and can be cleanly removed after use by application of heat.

Abstract: A curable epoxy resin formulation comprising a) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester, b) a hardener for epoxy resins consisting of 50 to 99% by weight of a polyoxyalkylene di- or triamine and 1 to 50% by weight of a hardener which is not a polyoxyalkyleneamine, and comprising as further optional components c) a curing accelerator, and d) customary modifiers for epoxy casting resins, with the proviso that the sum of the constituents in component a) as well as in component b) is in each case 100% by weight, is suitable for use as casting resin formulation for encapsulating electrical or electronic components.

Abstract: The invention provides a process for treating a metallic surface, other than a clean aluminum or aluminum alloy surface, which comprises treating the surface with an organosilane and exposing the surface to a laser.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: Reaction products of a microgel that contains carboxylic acid groups with a nitrogen-containing base have a high latency and high stability towards mechanical influences and are suitable as hardeners for one-component epoxy resin systems.

Abstract: A powder coating hardener based on epoxide compounds having a molecular weight of no more than 1500, which is solid at room temperature, the epoxide compounds consisting of 60 to 100% by weight of diglycidyl 1,4-cyclohexanedicarboxylate in the form of the pure trans-isomer or of a cis/-trans-isomer mixture having a melting point (peak maximum of the DSC scan at a heating rate of 10° per minute) of above 70° C., and of 0 to 40% by weight of other epoxide compounds, and wherein 0 to 15% by weight of the entire amount of epoxide compounds can contain aromatic structural elements in the molecule. The powder coating hardeners give powder coatings based on poly(meth)acrylic resins having free carboxyl groups, which have good flow even at low temperatures.

Abstract: A composition, which comprises (a) a compound containing at least one epoxy group in inner position per molecule, obtained by epoxidation of a natural unsaturated oil or of its derivative; (b) an epoxy compound selected from the group consisting of glycidyl ethers, glycidyl esters and cycloaliphatic epoxides; (c) a polycarboxylic acid anhydride; (d) a compound of formula I, I, III or IV or an acid adduct of a compound of formula I, II, III or IV  wherein R1 to R4 are each independently of one another hydrogen; C1-C18alkyl which is unsubstituted or substituted by one or more than one hydroxyl group amino group, halogen atom, cyano group, C1-C6alkoxy group or C1-C6cyanalkoxy group; C5-C14aryl, C6-C24aralkyl, C3-C14heteroaryl or C4-C14heteroaralkyl which are unsubstituted or substituted by one or more than one C1-C6alkyl group, C1-C6alkoxy group or halogen atom,  n is an integer from 1 to 3, and  R5 and R6 are each independently of the other C1-C6alkyl or, together with the

Abstract: Curable mixtures comprising a) an epoxy resin having more than one 1,2-epoxy group per molecule and b) as curing catalyst, an imidazole compound of formula I wherein R1, R2 and R3 are each independently of the others a hydrogen atom, a halogen atom, alkyl having from 1 to 20 carbon atoms, alkoxy having from 1 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms, or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms, and R4 is alkyl having from 1 to 20 carbon atoms, alkenyl having from 2 to 20 carbon atoms, alkynyl having from 2 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms, are suitable for the manufacture of moulding compounds and coatings, especially for the manufac

Abstract: In an apparatus for transporting thin boards, in particular coated printed circuit boards, comprising rows of spaced-apart grippers (2) which lie opposite one another and are arranged on a rod (3), in order to prevent the thin boards from sagging when transported, tension is applied to a rod (3), at least on one side of the printed circuit board (1), by an elastic device (15, 20), in order to tension the printed circuit board which has been gripped.

Abstract: The present invention is directed to a polyglycidyl compound having on average more than two, preferably more than two and a half, particularly preferably more than three, glycidyl groups per molecule and a Tg value (determined by DSC, heating rate=20° C./min) higher than 20° C.

Abstract: A moulding powder which is curable with the application of heat and pressure, comprising a mechanical mixture consisting of: a) a powdered epoxy compound containing on average more than one epoxy group in the molecule and having a softening point of above 60.degree. C., b) a powdered aliphatic or N-heterocyclic amine or a powdered amino group-containing adduct based on an aliphatic, cycloaliphatic, araliphatic or N-heterocyclic amine containing on average more than one amino group in the molecule and having a melting point or softening point of above 60.degree. C. and, optionally, c) customary additives for moulding powders, the particles of a) and b) being smaller than 200 .mu.m, is excellently suited for the preparation of coatings on heat-sensitive substrates and is used in particular in powder coating.

Abstract: An apparatus for coating board-shaped articles, especially printed circuit boards, is described which comprises at least one coating station having a pouring table for coating one surface of the printed circuit boards with preferably UV-hardenable plastics, lacquer or the like, and, adjoining that station, a vapor-removal and drying station having a vapor-removal drier for the removal of vapor from and drying of the coated surfaces of the printed circuit boards in the stream of hot air. The vapor-removal and drying station has an air processing module which is arranged in a housing which adjoins the entrance side of the housing of the vapor-removal drier and extends over the free space above the pouring table.

Abstract: The present invention relates to stereolithographic compositions containing an actinic radiation-curable and cationically polymerizable organic substance, a cationic initiator, a radical photoinitiator, and at least one cationic reactive modifier containing at least two reactive groups per molecule or at least one polyether polyol or mixtures thereof. The cationic reactive modifier has at least one chain extension segment with a molecular weight of at least about 100 and not more than about 2,000. The polyether polyol has a molecular weight greater than or equal to about 4,000. The use of the cationically reactive modifiers and polyether polyol modifiers substantially increases the flexibility and toughness of the cured articles without compromising photospeed, accuracy and wetting-recoatability of the compositions. The present invention further relates to a method of producing a cured product, particularly three-dimensional shaped articles by treating the composition described above with actinic radiation.

Abstract: Soluble poly(bis-9,9'-fluorenes) comprise identical or different structural repeating units of the formula I, ##STR1## where the two R.sub.1 s are, independently of one another, H, C.sub.1-C.sub.18 alkyl, C.sub.6 -C.sub.14 aryl, C.sub.7 -C.sub.15 aralkyl, C.sub.1 -C.sub.18 alkoxy, R.sub.2 --(O--C.sub.n H.sub.2n).sub.m --O--, C.sub.1 -C.sub.18 alkylthio, C.sub.1 -C.sub.18 dialkylamino, --C(O)OH, --C(O)O-C.sub.1 -C.sub.18 alkyl, --C(O)--N(C.sub.1 -C.sub.18 alkyl).sub.2, --SO.sub.3 H, --SO.sub.3 -C.sub.1 -C.sub.18 alkyl, --SO.sub.2 --N(C.sub.1 -C.sub.18 alkyl).sub.2, C.sub.1 -C.sub.17 -alkyl-C(O)--O-- or C.sub.1 -C.sub.17 alkyl-C(O)--, R.sub.2 is H or C.sub.1 -C.sub.12 alkyl, n is from 2 to 6 and m is from 1 to 12.The polymers can be used either alone or in admixture with at least one additional fluorophore whose absorption band overlaps the emission band (fluorescent emission) of the polymer of the formula I as active radiative layer for light-emitting diodes, VDUs and display elements.