Abstract: A heat sink includes a first housing adapted to receive a coolant in a first phase; one or more fins stacked on the first housing, the one or more fins having openings there-through to receive a second phase of the coolant; and a second housing coupled to the one or more fins to define an internal chamber.

Abstract: A cooling apparatus boiling and condensing liquid coolant has a vessel including a microporous surface enhancement coating applied on a thermally-conductive plate which is fully immersed under the liquid coolant in the vessel. The surface enhancement coating augments significantly a nucleate boiling heat transfer and critical heat flux when receiving heat from a heating object coupled to the thermally-conductive plate at a surface outside of the vessel. One embodiment of this invention including a vessel with a height/length dimension less than 300 mm, a microporous coating with nickel particles of 30-50 ?m in size bonded by a thermally-conductive binder, and water as the liquid coolant, without complicated radiator component, is used for cooling a heating electronics element.