Abstract: Several embodiments of a method for sealing pores on a porous substrate are disclosed. In one embodiment, the method comprises introducing first particles to the surface of the substrate and damaging the surface to decrease the size of the pores on the surface; introducing second particle to the surface; and forming a film on the surface covering the pores, where the film has a dielectric constant of 4 or less.
Type:
Application
Filed:
December 28, 2008
Publication date:
December 31, 2009
Applicant:
VARIAN SEMICONDUCTOR EQUIPEMENT ASSOCIATES, INC.