Abstract: A method of doping a substrate. The method may include implanting a dose of a helium species into the substrate through a surface of the substrate at an implant temperature of 300° C. or greater. The method may further include depositing a doping layer containing a dopant on the surface of the substrate, and annealing the substrate at an anneal temperature, the anneal temperature being greater than the implant temperature.
Type:
Grant
Filed:
December 22, 2015
Date of Patent:
March 7, 2017
Assignee:
Varian Semuconductor Equipment Associates, Inc.
Inventors:
Christopher R. Hatem, Christopher A. Rowland