Patents Assigned to Varioscale, Inc.
  • Lateral vias for connections to buried microconductors and methods thereof
    Patent number: 10262931
    Abstract: The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: April 16, 2019
    Assignees: National Technology & Engineering Solutions of Sandia, LLC, Varioscale, Inc.
    Inventors: David P. Adams, Kira L. Fishgrab, Karl Douglas Greth, Michael David Henry, Jeffrey Stevens, V. Carter Hodges, Randy J. Shul, Ronald S. Goeke, Robert K. Grubbs, Scott Silverman