Patents Assigned to VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
  • Publication number: 20210360825
    Abstract: A computer liquid cooling system includes a radiator having a built-in fluid tank, at least one heat exchanger pump and a plurality of fluid conduits. The radiator includes at least one first flow port and at least one second flow port for attachment of the plurality of fluid conduits thereto for actively moving a cooling fluid to and from the at least one heat exchanger pump. Heat generated from a heat generating device is transferred to cooling fluid flowing through the at least one heat exchanger pump, and then output to the radiator. The heated cooling fluid flows through the radiator having the built-in fluid tank, cooling along a plurality of heat exchanger fins. The cooling fluid flows to the heat exchanger pump to once again begin the cooling loop.
    Type: Application
    Filed: August 25, 2020
    Publication date: November 18, 2021
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventor: Yuan WU
  • Patent number: 11162738
    Abstract: A heat dissipation device has a frame assembly, a gravity loop thermosyphon, and a dissipating fin assembly. The gravity loop thermosyphon has a heat exchanger, a condenser, two bendable tubes, and working fluid. One end of each bendable tube communicates with the heat exchanger and another end of each bendable tube communicates with the condenser and thus the working fluid may circulate therein. After the bendable tubes are bent, the condenser can be moved to an appropriate location or tilted to an appropriate angle according to the environment, and then the location and the angle are fixed via the frame assembly so the gravity loop thermosyphon can adapt for different dissipation assemblies.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: November 2, 2021
    Assignee: VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD
    Inventors: Xuemei Wang, Leilei Liu
  • Publication number: 20210293486
    Abstract: This disclosure relates to a heat pipe includes a tubular body and a capillary structure. The tubular body has an inner surface. The inner surface forms a sealed chamber. The capillary structure is located in the sealed chamber and arranged on the inner surface. The tubular body includes a condensation section and an evaporation section connected to each other. The capillary structure includes a cold section and a heat section connected to each other. The cold section is disposed on the condensation section, and the heat section is disposed on the evaporation section. A wall thickness of the cold section is greater than a wall thickness of the heat section.
    Type: Application
    Filed: August 5, 2020
    Publication date: September 23, 2021
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Xue Mei WANG
  • Patent number: 11118603
    Abstract: A fan device includes a fan frame, an impeller, a plurality of cushion components, a plurality of first fasteners and a plurality of second fasteners. The fan frame includes a first frame body and a second frame body. The first frame body has a plurality of first engagement parts. The second frame body has a plurality of second engagement parts. The impeller is rotatably disposed on the fan frame. The cushion components are respectively located on different sides of the fan frame. The first fasteners are respectively disposed through the cushion components and engaged with the first engagement parts of the first frame body. The second fasteners are respectively disposed through the cushion components and engaged with the second engagement parts of the second frame body.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: September 14, 2021
    Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Shi Man Xu, Qiancheng Yue
  • Publication number: 20210222868
    Abstract: This disclosure relates to a light-emitting fan includes a fan frame, an impeller, and a light-emitting component. The fan frame includes a base, a first ring, and a second ring. The first ring is disposed on the base. The second ring is disposed on the first ring. The first ring is located between the base and the second ring, and the first ring and the second ring together form an accommodating space. The impeller is located in the accommodating space and rotatably disposed on the base. The light-emitting component is located in the first ring or the second ring. One of the first ring and the second ring is made of light-permeable plastic, the other one is made of light-impermeable plastic, and light from the light-emitting component is emitted through the first or second ring.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 22, 2021
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Shi-Man XU, Qiancheng YUE
  • Publication number: 20210199128
    Abstract: A fan device includes a fan frame, an impeller, a plurality of cushion components, a plurality of first fasteners and a plurality of second fasteners. The fan frame includes a first frame body and a second frame body. The first frame body has a plurality of first engagement parts. The second frame body has a plurality of second engagement parts. The impeller is rotatably disposed on the fan frame. The cushion components are respectively located on different sides of the fan frame. The first fasteners are respectively disposed through the cushion components and engaged with the first engagement parts of the first frame body. The second fasteners are respectively disposed through the cushion components and engaged with the second engagement parts of the second frame body.
    Type: Application
    Filed: June 17, 2020
    Publication date: July 1, 2021
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Shi Man XU, Qiancheng YUE
  • Publication number: 20210195799
    Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.
    Type: Application
    Filed: June 11, 2020
    Publication date: June 24, 2021
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Xiao Min ZHANG, Xue Mei WANG
  • Publication number: 20200363134
    Abstract: A heat dissipation device has a frame assembly, a gravity loop thermosyphon, and a dissipating fin assembly. The gravity loop thermosyphon has a heat exchanger, a condenser, two bendable tubes, and working fluid. One end of each bendable tube communicates with the heat exchanger and another end of each bendable tube communicates with the condenser and thus the working fluid may circulate therein. After the bendable tubes are bent, the condenser can be moved to an appropriate location or tilted to an appropriate angle according to the environment, and then the location and the angle are fixed via the frame assembly so the gravity loop thermosyphon can adapt for different dissipation assemblies.
    Type: Application
    Filed: October 7, 2019
    Publication date: November 19, 2020
    Applicant: VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD
    Inventors: Xuemei WANG, Leilei LIU