Abstract: An ion-cut machine and method for slicing silicon ingots into thin wafers for solar cell manufacturing is set forth, amongst other embodiments and applications. One embodiment comprises two carousels: first carousel (100) adapted for circulating workpieces (55) under ion beam (10) inside target vacuum chamber (30) while second carousel (80) is adapted for carrying implanted workpieces through a sequence of process stations that may include annealing (60), cleaving (70), slice output (42), ingot replacement (52), handle bonding, cleaning, etching and others. Workpieces are essentially swapped between carousels. In one embodiment, the swapping system comprises a high throughput load lock (200) disposed in the wall of the vacuum chamber (30), a vacuum swapper (110) swapping workpieces between first carousel (100) and load lock (200), and an atmospheric swapper (90) swapping workpieces between load lock (200) and second carousel (80).

Abstract: Processes and machines for producing large area sheets or films of crystalline, polycrystalline, or amorphous material are set forth; the production of such sheets being valuable for the manufacturing of solar photovoltaic cells, flat panel displays and the like. In one embodiment the surface of a rotating cylindrical workpiece (10) is implanted with an ion beam (30), whereby a layer of weakened material if formed below the surface, whereby sheet (20) may be detached and peeled off in an unrolling fashion, producing arbitrarily large, monolithic sheets. Optional annealing heater (40) may be used to improve the quality of the film. The sheet may also be optionally supported on a temporary or permanent handle (50) which may be rigid sheet such as glass, or a flexible sheet, such as a polymer film. Representative pinch roller (60) may assist in the lamination of handle (50) to sheet (20) before or after the point of separation of sheet (20) from workpiece (10).