Abstract: A position drive for a wafer in a system for testing of integrated circuit components of the wafer includes a first drive assembly for quick lifting of a wafer-supporting member towards testing probes, second drive assembly for positioning the wafer-supporting member in two stable positions in a vertical direction for compensating thickness allowances of the wafers to be tested and a third drive assembly for mechanical rotation of the wafer-supporting member through any required angle.
Type:
Grant
Filed:
December 7, 1981
Date of Patent:
May 15, 1984
Assignee:
Veb Zentrum fur Forschung und Technologie Mikroelekronik