Abstract: The disclosed system may comprise a mainframe computing resource, a data library, a data processing appliance, and a distributed system. The data library may be securely connected to the mainframe computing resource. The data library may be configured to receive data from the mainframe computing resource via a first interface. The data processing appliance may be configured to read and write data to the data library via a second user interface. The distributed system may be configured to receive data from the data processing appliance. The distributed system may be further configured to process the data based on a workflow from the mainframe computing system.

Abstract: The disclosed system may comprise a mainframe computing resource, a data library, a data processing appliance, and a distributed system. The data library may be securely connected to the mainframe computing resource. The data library may be configured to receive data from the mainframe computing resource via a first interface. The data processing appliance may be configured to read and write data to the data library via a second user interface. The distributed system may be configured to receive data from the data processing appliance. The distributed system may be further configured to process the data based on a workflow from the mainframe computing system.

Abstract: A sputtering system comprising three concentric cylinders. The inner and outer cylinders, along with top and bottom sealing flanges, form an annular chamber with cylindrical walls. A central cylinder, disposed between the inner and outer cylinders, includes substrate-carrying openings and serves as a cylindrical carriage which substantially fills the annular chamber passageway and is rotatable in predetermined steps relative to the chamber. Substrate processing devices for deposition, etching, heating, and cooling arc attached around the circumference of the inner and/or outer cylinders. Vacuum pumps are located between substrate processing devices. The openings in the cylindrical carriage are each fitted with a substrate holder for supporting a multiplicity of substrates. Entrance and exit vacuum load-locks are provided for transferring substrates into and out of the system. The system is designed for substrate processing temperatures of 1000.degree. C. and above.

Abstract: A low-noise toroidal thin film head ("TFH") device has low coil resistance and inductance, especially suitable for very high magnetic recording areal densities and channel frequencies. The length of a toroidal coil turn is only about 20-30% that of the length of an average turn in the conventional planar spiral coil design. This allows either reduction of the device thermal noise (by about 6 dB) and/or increase of the device operational frequency bandwidth (by a factor of 3-5). The toroidal coil coupling efficiency between each turn and the magnetic core is practically 100%, thereby improving the write and read-back efficiencies. In one embodiment a non-via large back-closure contact area is provided between the bottom and top magnetic poles along their entire back-side width, and all other open branches and loose ends in the magnetic circuit are eliminated. The magnetic core has a gradual, smooth toroidal (or a horse-shoe) shape with no loose ends, nooks, crevices, or sharp corners.