Patents Assigned to Vermon
  • Patent number: 12226799
    Abstract: A method of manufacturing a capacitive micromachined ultrasonic transducer (CMUT) includes the steps of: a) forming a first dielectric layer on a first substrate; b) forming a second dielectric layer on a second substrate; c) forming a cavity in the first or second dielectric layer; d) assembling the first and second substrates by direct bonding of the surface of the second dielectric layer opposite to the second substrate to the surface of the first dielectric layer opposite to the first substrate; e) removing the second substrate to only keep above the cavity a suspended membrane formed by the second dielectric layer; and f) forming an upper electrode on the surface of the membrane opposite to the first substrate.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: February 18, 2025
    Assignee: VERMON SA
    Inventors: Nicolas Senegond, Dominique Gross, Cyril Meynier
  • Patent number: 12201469
    Abstract: A portable electronic device for assessing a human cardiovascular activity includes first and second probes substantially parallel to each other and located on either side of a third probe, substantially perpendicular to the first and second probes, each probe comprising an array of ultrasound transducers, and a control circuit configured to: a) estimate, by means of a first ultrasound beam emitted by the first probe, a position of a blood vessel with respect to the device; and b) adjust a second ultrasound beam, emitted by the third probe, according to the estimated position of the blood vessel.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: January 21, 2025
    Assignee: VERMON SA
    Inventor: Maxime Benchemoul
  • Patent number: 12172187
    Abstract: The present disclosure relates to a method of simultaneous manufacturing, from a same substrate (101), at least one first CMUT transducer (I) having a first resonance frequency and at least one second CMUT transducer (II) having a second resonance frequency different from the first frequency, the method comprising the steps of: a) for each transducer (I, II), forming a cavity (103) on the upper surface side of the substrate, and forming a flexible membrane (105) suspended above the cavity (103); b) forming a first layer (109) extending over a portion only of the upper surface of the membrane (105) of the first transducer (I) and which does not extend over the membrane (105) of the second transducer (II); and c) forming a second layer (111) extending over the entire upper surface of the membrane (105) of the first transducer and over the entire upper surface of the membrane of the second transducer.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: December 24, 2024
    Assignee: VERMON SA
    Inventors: Nicolas Senegond, Dominique Gross, Cyril Meynier
  • Patent number: 12145838
    Abstract: The present disclosure relates to a CMUT transducer (200) comprising: —a conductive or semiconductor substrate (201) coated with a stack of one or a plurality of dielectric layers (203, 213); —a cavity (205, 215) formed in said stack; —a conductive or semiconductor membrane (221) suspended above the cavity; —at the bottom of the cavity, a conductive region (209) in contact with the upper surface of the substrate, said conductive region being interrupted on a portion of the upper surface of the substrate; and—in the cavity, a stop structure (207) made of a dielectric material localized on or above the area of interruption of the conductive region (209).
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: November 19, 2024
    Assignee: VERMON SA
    Inventors: Cyril Meynier, Dominique Gross, Nicolas Senegond
  • Patent number: 11679975
    Abstract: A method of manufacturing a panel transducer scale package includes securing acoustic components at predetermined locations on a first carrier substrate with a first surface of the acoustic components positioned adjacent to the first carrier substrate. ASIC components are also secured at predetermined locations on the first carrier substrate with a first surface of the ASIC components positioned adjacent to the first carrier substrate. Photoresist resin is applied over the acoustic components and the ASIC components such that a second surface of the acoustic components is left exposed from the photoresist resin. The first carrier substrate is removed to expose the first surface of the acoustic components and the first surface of the ASIC components. A buildup layer is formed including electrical pathways between each of the acoustic components and the ASIC components, and the photoresist resin is removed.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: June 20, 2023
    Assignee: VERMON SA
    Inventors: Claire Bantignies, Guillaume Férin
  • Publication number: 20230181158
    Abstract: A portable two-mode probe intended to be applied against a biological tissue to be examined, the probe comprising: an ultrasonic transducer (34, 63), configured to emit ultrasonic waves into the tissue and to receive ultrasonic waves reflected by the tissue, the transducer extending along a transverse axis; at least two optodes (32, 60, 62a, 62b) placed on either side of the transverse axis, such that the transducer extends between the two optodes; each optode comprising a casing (52, 61), the casing containing: a light emitter (31), configured to emit a light wave toward the tissue; and/or an optical detector (32), configured to detect a light wave scattered by the tissue; the optodes being arranged such that at least one light emitter and at least one optical detector are placed on either side of the transducer; at least one optical detector having a detection area (53, 63a, 63b) formed from a semiconductor and connected to a circuit board (54).
    Type: Application
    Filed: March 3, 2020
    Publication date: June 15, 2023
    Applicants: Micro Photon Devices Srl, VERMON S.A., COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, POLITECNICO DI MILANO
    Inventors: Simone TISA, Alessandro RUGGERI, Bogdan ROSINSKI, Emmanuel MONTAUBAN, Jean-Marc DINTEN, Antonio PIFFERI, Paola TARONI, Alberto DALLA MORA, Alberto TOSI
  • Patent number: 11387403
    Abstract: A piezoelectric bimorph cantilever beam system includes a shim having a first main surface, a second main surface opposite the first main surface, a proximal end connected to an anchor, and a distal end opposite the proximal end. The system further includes a first piezoelectric layer laminated on the first main surface of the shim and a second piezoelectric layer laminated on the second main surface of the shim. A first beam stiffener is provided over the first main surface of the shim adjacent to the anchor with the first beam stiffener at least partially covering the first piezoelectric layer. A second beam stiffener is provided over the second main surface of the shim adjacent to the anchor with the second beam stiffener at least partially covering the second piezoelectric layer.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: July 12, 2022
    Assignees: VERMON S.A., UNIVERSITE GRENOBLE ALPES
    Inventors: Libor Rufer, Skandar Basrour, Emilie Trioux, Guillaume Férin, Claire Bantignies, Hung Le Khanh, Bogdan Rosinski, An Nguyen-Dinh
  • Patent number: 10097112
    Abstract: A vibrational multi-morph piezoelectric energy harvester includes a composite shim having a parallelepiped form with a thickness dimension made smaller than width and length dimensions, and having a stiffness shifting from one extremity to the other extremity to minimize mechanical constraints developed at a clamping area; a seismic mass mounted at an end opposite to the clamping area to mechanically match the system to the surrounding vibration resonance; one or more piezoelectric layers laminated on said composite shim; and electrodes plated onto the one or more piezoelectric layers for connection to an electronic harvesting circuit, a battery, or a super capacitor.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: October 9, 2018
    Assignee: VERMON S.A.
    Inventors: An Nguyen-Dinh, Guillaume Ferin, Claire Bantignies, Hung Le Khanh, Cyril Meynier, Etienne Flesch
  • Patent number: 9816964
    Abstract: An ultrasonic non-destructive testing method and device for rail applications uses a plurality of phased array transducers to inspect aluminothermit weld defects located in a head portion, a web portion, an ankle portion, and a toe portion of a weld of a rail section. The method includes: scanning the head portion of the weld including: a first phased array transducer positioned above the weld and a second phased array transducer positioned a distance from the first phased array transducer to provide inclined access to the weld; and scanning the toe portion of the weld including: positioning pairs of third, fourth, and fifth phased array transducers on a surface of the toe portion, such that the pairs of third, fourth and fifth phased array transducers are disposed symmetrically with one of the pair on each side of the toe portion.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: November 14, 2017
    Assignee: Vermon S.A.
    Inventors: An Nguyen-Dinh, Stephane Michau, Christopher Spree, Simon-Peter Santospirito, Aasim Khalid
  • Patent number: 9579081
    Abstract: A device for a bimodal diagnostic probe with optical and ultrasonic imaging, the probe including a main body supporting an ultrasonic transducer at its front end. The device includes a shell, an illumination mechanism mounted on a front end of the shell to light outside of the shell, and a collection or detection mechanism mounted on the front end of the shell to collect or detect an optical signal produced outside the shell. The shell includes an attachment mechanism to reversibly assemble it around the main body of the probe, with the illumination mechanism and the collection or detection mechanism mounted on the shell.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: February 28, 2017
    Assignees: Commissariat à l'énergie atomique et aux énergies alternatives, SA VERMON
    Inventors: Jérôme Boutet, An Nguyen-Dinh, Mathieu Debourdeau, Odile Messineo, Christophe Notard
  • Publication number: 20140187958
    Abstract: A device for a bimodal diagnostic probe with optical and ultrasonic imaging, the probe including a main body supporting an ultrasonic transducer at its front end. The device includes a shell, an illumination mechanism mounted on a front end of the shell to light outside of the shell, and a collection or detection mechanism mounted on the front end of the shell to collect or detect an optical signal produced outside the shell. The shell includes an attachment mechanism to reversibly assemble it around the main body of the probe, with the illumination mechanism and the collection or detection mechanism mounted on the shell.
    Type: Application
    Filed: June 7, 2012
    Publication date: July 3, 2014
    Applicants: SA VERMON, COMMISSARIAT A I'ENERGIE ATOMIQUE ET AUX ENE ALT
    Inventors: Jérôme Boutet, An Nguyen-Dinh, Mathieu Debourdeau, Odile Messineo, Christophe Notard
  • Patent number: 8456958
    Abstract: A capacitive micro-machined ultrasonic transducer (CMUT) array includes an improved elementary aperture for imaging operations. The transducer can be of a linear, curved linear, annular, matrix or even single surface configuration. The elementary apertures thereof are formed by a specific arrangement of capacitive micromachined membranes (CMM) so as to exhibit ideal acoustical and electrical behavior when operated with imaging systems. The CMM arrangements can be either conventional where the element transducers of the array are uniformly shaped by predefined CMMs in a manner such as to exhibit acoustic behavior similar to a piezoelectric transducer, or can be more sophisticated, wherein each element transducer is formed by a specific combination of different CMMs (i.e., of a different size and/or shape) so as to provide the transducer with built-in acoustic apodization that can be implemented in the azimuth and/or elevation dimension of the device.
    Type: Grant
    Filed: February 21, 2006
    Date of Patent: June 4, 2013
    Assignee: Vermon S.A.
    Inventors: Nicolas Felix, Aimé Flesch, Remi Dufait, An Nguyen-Dinh
  • Patent number: 7798971
    Abstract: A motorized scanhead device is capable of rotating an array transducer through 360 degrees of angular rotation in a manner such as to provide acquisition of images in successive scanning planes arranged around the principal axis of the device. The device can be incorporated in endoscopes (e.g., transesophageal endoscopes), laparoscopes, endocavity or intracavity probes so as to provide an expanded angle of vision or to render 3D images, without the need for external movement of the device. The motorized scanhead device includes a motor that is isolated from the transducer signal interconnections in order to minimize electrical discharges associated with motor operation and to provide more room between an associated probe housing and the scanhead device.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: September 21, 2010
    Assignee: Vermon
    Inventors: Aimé Flesch, An Nguyen-Dinh
  • Patent number: 7770279
    Abstract: A micro-machined ultrasonic transducer substrate for immersion operation is formed by a particular arrangement of a plurality of micro-machined membranes that are supported on a silicon substrate. The membranes, together with the substrate, form surface microcavities that are vacuum sealed to provide electrostatic cells. The cells can operate at high frequency and can cover a broader bandwidth in comparison with conventional piezoelectric bulk transducers.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: August 10, 2010
    Assignee: VERMON
    Inventors: An Nguyen-Dinh, Nicolas Felix, Aimé Flesch
  • Patent number: 7588540
    Abstract: An ultrasonic imaging probe is provided which is capable of capturing “on-the-fly” scanning planes in successive positions of the probe so as to form a volumetric image representation at a real time frame rate. The probe includes a flexible sealing membrane for a coupling fluid. Laterally extending folding portions of the flexible membrane provide fluid isolation and cancellation of parasitic constraining forces normally generated during probe movement.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: September 15, 2009
    Assignee: Vermon
    Inventors: An Nguyen-Dinh, Aimé Flesch, Rémi Dufait, Philippe Auclair
  • Patent number: 7489593
    Abstract: A micro-machined ultrasonic transducer substrate for immersion operation is formed by a particular arrangement of a plurality of micro-machined membranes that are supported on a silicon substrate. The membranes, together with the substrate, form surface microcavities that are vacuum sealed to provide electrostatic cells. The cells can operate at high frequency and can cover a broader bandwidth in comparison with conventional piezoelectric bulk transducers.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: February 10, 2009
    Assignee: Vermon
    Inventors: An Nguyen-Dinh, Nicolas Felix, Aimé Flesch
  • Patent number: 7103960
    Abstract: A method is provided for making a backing layer for an ultrasonic matrix array transducer useful in medical imaging and the like. A conductive grid is provided which includes a plurality of micro-contacts each joined together by a common base so that spaces are provided between the free ends of the contacts. A mold for the grid is filled with an acoustically absorbent material such that the absorbent material fills the spaces between the contacts, so as to produce a block when cured. The common base is removed so as to separate the contacts from one another within the block. Further machining exposes the opposite ends of micro-contacts so that a like number of contact faces or pads are provided at opposed surfaces of the backing layer. Improved transducer constructions are also disclosed.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: September 12, 2006
    Assignee: Vermon
    Inventor: Flesch Aimé
  • Patent number: 7081093
    Abstract: An ultrasonic apparatus is provided for producing three dimensional images using at least one moving curved array transducer for scanning a volume of a region of interest to be imaged. The apparatus includes an acoustic front shell having complex shape and an ultrasonic transducer adapted for swinging movement underneath the front shell and having a front surface of a shape conforming to the complex shape of the front shell. A motor provides the swinging movement of the ultrasonic array transducer underneath the front shell so as to scan a volume of the region of interest. The shell and a transducer carrier may be of an ovoid shape. The transducer may include lips at superior edges thereof which contain a coupling grease. Multiple transducers for different applications may be employed.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: July 25, 2006
    Assignee: Vermon
    Inventor: Aimé Flesch
  • Patent number: 7066887
    Abstract: Ultrasonic probe devices are provided which are particularly suitable for use as invasive imaging probes such as endocavity probes and endoscopic probes. The probe devices include a dual cross-scanning bi-plane array transducer formed by a pair of orthogonal, intersecting transducer arrays. The probe devices are capable of providing, either simultaneously or alternately, crossing scanning through a single symmetrical scanning axis.
    Type: Grant
    Filed: October 21, 2003
    Date of Patent: June 27, 2006
    Assignee: Vermon
    Inventors: Aimé Flesch, An Nguyen-Dinh
  • Patent number: 6915696
    Abstract: A method is provided for manufacturing crossing/intersecting transducer arrays including first and second ultrasonic transducer arrays which intersect centrally of one another. Each transducer operates independently without any decrease in acoustic performance. The first and second arrays have their own independent signal electrodes, respectively disposed on the front and rear surfaces of the device. Because the arrays are built on a unique piezoelectric member, a portion of signal electrode of each array is adapted to be connected to ground in a manner permitting proper operation of the entire array. A method of forming matching layer sets incorporating electrical interconnections is also provided.
    Type: Grant
    Filed: February 27, 2003
    Date of Patent: July 12, 2005
    Assignee: Vermon
    Inventors: Rémi Dufait, An Nguyen-Dinh, Philippe Auclair, Christophe Notard, Aimé Flesch