Patents Assigned to VI Chip, Inc.
  • Patent number: 9387633
    Abstract: An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.
    Type: Grant
    Filed: April 22, 2013
    Date of Patent: July 12, 2016
    Assignee: VI Chip, Inc.
    Inventors: Patrizio Vinciarelli, Michael B. LaFleur
  • Patent number: 9087656
    Abstract: A method and apparatus for efficiently converting power from an AC line is disclosed. The power converter supplies power to the load, performing power factor correction at nominal and high loads, i.e. above a predetermined output power threshold, and operating in an on-demand burst mode synchronized to the AC line at low loads, i.e. below a predetermined output power threshold. The duration of an operating interval during which power conversion takes place may be reduced and varied at low loads as a function of the output power demands to increase overall conversion efficiency. The operating interval may be centered about a peak in the input voltage waveshape for operating intervals that are less than a full rectification period. For operating intervals that are less than a full rectification period a modified power factor correction may be used, in which the input current waveshape approximates the input voltage waveshape during the operating interval.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: July 21, 2015
    Assignee: VI Chip, Inc.
    Inventor: Patrizio Vinciarelli
  • Patent number: 8427267
    Abstract: An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: April 23, 2013
    Assignee: VI Chip, Inc.
    Inventor: Patrizio Vinciarelli
  • Patent number: 8427269
    Abstract: An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: April 23, 2013
    Assignee: VI Chip, Inc.
    Inventors: Patrizio Vinciarelli, Michael B. LaFleur
  • Patent number: 8222772
    Abstract: A method and apparatus for efficiently converting power from an AC line is disclosed. The power converter supplies power to the load, performing power factor correction at nominal and high loads, i.e. above a predetermined output power threshold, and operating in an on-demand burst mode at low loads, i.e. below a predetermined output power threshold, e.g. to supply power in a green mode to supervisory circuitry during a powered off state. The duration of an operating interval during which power conversion takes place may be reduced and varied at low loads as a function of the output power demands to increase overall conversion efficiency. The operating interval may be centered about a peak in the input voltage waveshape for operating intervals that are less than a full rectification period.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: July 17, 2012
    Assignee: VI Chip, Inc.
    Inventor: Patrizio Vinciarelli