Patents Assigned to VI Chip, Inc.
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Patent number: 9387633Abstract: An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.Type: GrantFiled: April 22, 2013Date of Patent: July 12, 2016Assignee: VI Chip, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur
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Patent number: 9087656Abstract: A method and apparatus for efficiently converting power from an AC line is disclosed. The power converter supplies power to the load, performing power factor correction at nominal and high loads, i.e. above a predetermined output power threshold, and operating in an on-demand burst mode synchronized to the AC line at low loads, i.e. below a predetermined output power threshold. The duration of an operating interval during which power conversion takes place may be reduced and varied at low loads as a function of the output power demands to increase overall conversion efficiency. The operating interval may be centered about a peak in the input voltage waveshape for operating intervals that are less than a full rectification period. For operating intervals that are less than a full rectification period a modified power factor correction may be used, in which the input current waveshape approximates the input voltage waveshape during the operating interval.Type: GrantFiled: June 18, 2012Date of Patent: July 21, 2015Assignee: VI Chip, Inc.Inventor: Patrizio Vinciarelli
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Patent number: 8427267Abstract: An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.Type: GrantFiled: June 29, 2009Date of Patent: April 23, 2013Assignee: VI Chip, Inc.Inventor: Patrizio Vinciarelli
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Patent number: 8427269Abstract: An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.Type: GrantFiled: June 29, 2009Date of Patent: April 23, 2013Assignee: VI Chip, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur
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Patent number: 8222772Abstract: A method and apparatus for efficiently converting power from an AC line is disclosed. The power converter supplies power to the load, performing power factor correction at nominal and high loads, i.e. above a predetermined output power threshold, and operating in an on-demand burst mode at low loads, i.e. below a predetermined output power threshold, e.g. to supply power in a green mode to supervisory circuitry during a powered off state. The duration of an operating interval during which power conversion takes place may be reduced and varied at low loads as a function of the output power demands to increase overall conversion efficiency. The operating interval may be centered about a peak in the input voltage waveshape for operating intervals that are less than a full rectification period.Type: GrantFiled: February 8, 2010Date of Patent: July 17, 2012Assignee: VI Chip, Inc.Inventor: Patrizio Vinciarelli