Patents Assigned to VIA Technologies, Inc. of R.O.C.
  • Non-metal mesh cover for metal chassis
    Patent number: 7355849
    Abstract: The present invention relates to a chassis structure for an electronic system containing a plurality of electronic components therein. The present invention provides a composite chassis structure comprising a nonmetal mesh cover formed on one or more surfaces of the metal chassis to obtain additional thermal budget and human-friendly chassis surface.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: April 8, 2008
    Assignee: VIA Technologies, Inc. of R.O.C.
    Inventor: Shih-Chang Ku
  • CDMA wireless communication system including finite impulse response filter and phase equalizer for inter-chip interference reduction
    Patent number: 6980771
    Abstract: A digital CDMA wireless communication system. The system includes one or more of said transmitters with a base station baseband processor, a finite impulse response (FIR) filter, a pre-distortion phase equalizer and a digital-to-analog (DAC) converter. Receivers have an analog-to-digital (ADC) converter, a FIR filter, a phase equalizer and a receiver baseband processor. The receiver FIR filter is matched to the transmitter FIR filter and the receiver phase equalizer is matched to the pre-distortion phase equalizer.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: December 27, 2005
    Assignee: VIA Technologies, Inc. of R.O.C.
    Inventor: Hong Kui Yang