Abstract: An electronic component lead inspection device, the device comprising: a pickup header for picking up an electronic component package to move same; a light source for illuminating a light to the electronic component package; a acquiring unit for acquiring an image of the electronic component package underneath a travelling passage of the electronic component package; a control unit for outputting an image signal of the electronic component package acquired by the acquiring unit; and an inspecting and displaying unit for receiving the image signal of the electronic component package output from the control means to inspect and display the image of the electronic component package, such that the electronic component packages can be all inspected on real time, while the electronic component packages are being moved, inspected and produced.