Abstract: The invention relates to a DC to AC converter circuit. In particular, the invention relates to a half-bridge inverter for converting a DC to an AC voltage. The half-bridge inverter for converting a DC input voltage to provide an AC output voltage at an output terminal, comprising a first switching circuit connected to at least one input terminal and to the output terminal and configured to provide a high or a low voltage level at the output terminal; a second switching circuit connected to the output terminal and configured to provide a connection to an intermediate voltage level, the intermediate voltage level being between the high and the low voltage level; and wherein the second switching circuit is further connected to the at least one input terminal allowing the second switching circuit to provide the high or the low voltage level at the output terminal.

Abstract: A power semiconductor module having a substrate (102), at least one power semiconductor device (104) and at least one lead frame element (106), and a method for producing such a power semiconductor module (100). The connection between the at least one first lead frame element and the power semiconductor device as well as the connection between the first lead frame element and the substrate comprise a sintered metal connection (110), preferably a sintered silver connection.

Abstract: The invention relates to a DC to AC converter circuit. In particular, the invention relates to a half-bridge inverter for converting a DC to an AC voltage. The half-bridge inverter for converting a DC input voltage to provide an AC output voltage at an output terminal, comprising a first switching circuit connected to at least one input terminal and to the output terminal and configured to provide a high or a low voltage level at the output terminal; a second switching circuit connected to the output terminal and configured to provide a connection to an intermediate voltage level, the intermediate voltage level being between the high and the low voltage level; and wherein the second switching circuit is further connected to the at least one input terminal allowing the second switching circuit to provide the high or the low voltage level at the output terminal.

Abstract: An electrical power module (2) to be mounted on a printed circuit board (1), comprising a first side (21) to be mounted on a surface of a heat sink (3), wherein, in a mounted position of the electrical power module (2) on the heat sink (3), the first side (21) is arranged substantially parallel to the heat sink (3), and a second side (22) provided with electrical connection elements (23), wherein the electrical connection elements (23) are adapted to electrically connect the electrical power module (2) to the printed circuit board (1).

Abstract: The present invention relates to an electrical press-in contact, particularly press-in pin contact, for transmitting electric current and/or electrical signals, comprising a press-in section and a mounting section which are mechanically coupled with each other via a relief section, and the relief section comprises a compensating portion and a stop portion, wherein the compensating portion allows a coupled relative movement of the press-in section and the mounting section, and the stop portion blocks a movement of press-in section and mounting section towards each other. Furthermore, the present invention relates to an electrical or electronic module or a printed circuit board comprising an electrical press-in contact according to the invention.

Abstract: The present invention relates to power modules for controlling an input current to provide an output current, in particular, to such a power module (100) comprising at least one semiconductor switch for controlling the input current and a circuit substrate. The circuit substrate (108, 110) has at least one input terminal for being connected to an input voltage and at least one output terminal for outputting the output voltage. The input terminal and the output terminal are connected to each other via a main current path (104) that is controlled by the semiconductor switch. Said power module further comprises at least one transient current path (102) with extremely low inductivity for carrying a transient current during a switching operation of the semiconductor switch. The main path for the continuous current has a low ohmic resistance, but does not have to be designed to have a specifically low inductance.

Abstract: The present invention relates to an electrical press-in contact, particularly press-in pin con-tact, for transmitting electric current and/or electrical signals, comprising a press-in section and a mounting section which are mechanically coupled with each other via a relief section, and the relief section comprises a compensating portion and a stop portion, wherein the compensating portion allows a coupled relative movement of the press-in section and the mounting section, and the stop portion blocks a movement of press-in section and mounting section towards each other. Furthermore, the present invention relates to an electrical or electronic module or a printed circuit board comprising an electrical press-in contact according to the invention.