Abstract: A system for monitoring the material changes in a structure is disclosed through the use monitoring instruments embedded within the structure. The instruments have at least one sensor with electrodes in contact with the surrounding material and electronics that are contained within the instrument. The sensor signals are converted to digital and transmitted to an external data logger or computer for display of the digitized signals. The connection between the microcontroller and the data logger can be either through hardwire or RF. Power is provided to the electronic sensors through either external or local methods. A power management system can be used to place the electronics into a sleep mode when not in use. The electronics are encapsulated within potting material within an instrument case that is manufactured from a material having a flexural modulus equal to, or greater than, the surrounding material to prevent mechanical failure of the device before failure of the surrounding material.