Abstract: The present disclosure provides a light sensing element including a unit. The unit includes a plurality of photodiodes, a color filter disposed above the photodiodes, and a light host embedded in the color filter. The light host is a hollow structure disposed above the photodiodes. The color filter includes a first portion surrounding the light host, a second portion surrounded by the light host, and a third portion covering and physically contacting the first portion, the light host, and the second portion.

Abstract: The spectrometer includes a lightguide substrate, an upper grating layer, a lower grating layer, an image sensor, and a readout circuit. The upper grating layer is disposed on the lightguide substrate and configured to receive a light. The upper grating layer includes a first grating structure, a second grating structure, and a third grating structure, and the first, second, and third grating structures have different grating periods. The lightguide substrate is configured to diffract the light when the light propagates into the lightguide substrate, such that multiple diffraction lights are formed and each of the multiple diffraction lights has different wavelengths and different optical path. The lower grating layer is disposed under the lightguide substrate and configured to emit the multiple diffraction lights. The image sensor is disposed under the lower grating layer. The readout circuit is disposed under the image sensor.

Abstract: An operating method of an under-display camera system includes: providing a raw data by a pixel array; generating, by a plurality of color filters respectively disposed on a plurality of first photodiodes of the pixel array, a color information in accordance with the raw data; generating, by a plurality of first narrowband filters respectively disposed on a plurality of second photodiodes of the pixel array, a first narrowband information in accordance with the raw data, wherein a spectrum linewidth of the plurality of first narrowband filters is in a range from 5 nm to 70 nm; reconstructing an edge information from the first narrowband information based on one of a plurality of diffraction patterns provided by a database unit of a point spread function; and obtaining an image by combining the edge information with the color information.

Abstract: An electrode structure including a top electrode and a bottom electrode located below the top electrode. The top electrode includes a plurality of inner electrodes and an outer electrode connected with the inner electrodes. The inner electrodes are configured to filter a light by wavelength range and filter the light into a polarized light. The inner electrodes extend along a first direction. Each of the inner electrodes includes a metal structure having a first portion and a second portion and a dielectric structure located between the first portion and the second portion of the metal structure. The first portion, the dielectric structure, and the second portion are arranged along a second direction perpendicular to the first direction.

Abstract: An optical structure includes a grating coupler and a microlens. The grating coupler is configured to receive a laser light. The microlens is above the grating coupler, in which a metal shielding covers the microlens and has an opening to allow the laser light entering an effective coupling region of the grating coupler.

Abstract: An optical system includes a light module, an optical element on a first grating coupler, and a second grating coupler. The light module emits three beams from different positions. The optical element is below the light module and is configured to change incident angles of the three beams and to focus the three beams at the same region of the first grating coupler. The first grating coupler is below the optical element and is configured to couple the three beams into a light-guide substrate. The light-guide substrate is connected to the first grating coupler and is configured to transmit the three beams. The second grating coupler is connected to the light-guide substrate and is configured to enable the three beams departing from the light-guide substrate after the three beams have traveled the same optical path.

Abstract: An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.

Abstract: An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.

Abstract: An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.

Abstract: An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.

Abstract: A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.

Abstract: A wafer-level test module is disclosed to include a base layer having multiple first apertures spaced from one another at a pitch corresponding to the pitch of the image sensor chips of an integrated circuit wafer, a cover layer having second apertures respectively axially aimed at the first apertures, and an optical layer sandwiched between the base layer and the cover layer having multiple optical lenses of which the optical axes pass through the first apertures and the second apertures, so that when one image capturing device of the image sensor chips of an integrated circuit wafer is adjusted to the image plane of one of the optical lenses and the wafer-level test module is set in alignment with the integrated circuit wafer horizontally and vertically, then the effective test light can be simultaneously projected onto the image capturing devices of the respective image sensor chips through the wafer-level test module to achieve an effective wafer-level test on multiple image sensor chips of the integrated

Abstract: An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.

Abstract: A wafer-level test module is disclosed to include a base layer having multiple first apertures spaced from one another at a pitch corresponding to the pitch of the image sensor chips of an integrated circuit wafer, a cover layer having second apertures respectively axially aimed at the first apertures, and an optical layer sandwiched between the base layer and the cover layer having multiple optical lenses of which the optical axes pass through the first apertures and the second apertures, so that when one image capturing device of the image sensor chips of an integrated circuit wafer is adjusted to the image plane of one of the optical lenses and the wafer-level test module is set in alignment with the integrated circuit wafer horizontally and vertically, then the effective test light can be simultaneously projected onto the image capturing devices of the respective image sensor chips through the wafer-level test module to achieve an effective wafer-level test on multiple image sensor chips of the integrated

Abstract: An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.

Abstract: A wafer-level test module is disclosed to include a base layer having multiple first apertures spaced from one another at a pitch corresponding to the pitch of the image sensor chips of an integrated circuit wafer, a cover layer having second apertures respectively axially aimed at the first apertures, and an optical layer sandwiched between the base layer and the cover layer having multiple optical lenses of which the optical axes pass through the first apertures and the second apertures, so that when one image capturing device of the image sensor chips of an integrated circuit wafer is adjusted to the image plane of one of the optical lenses and the wafer-level test module is set in alignment with the integrated circuit wafer horizontally and vertically, then the effective test light can be simultaneously projected onto the image capturing devices of the respective image sensor chips through the wafer-level test module to achieve an effective wafer-level test on multiple image sensor chips of the integrated

Abstract: A wafer-level test module is disclosed to include a base layer having multiple first apertures spaced from one another at a pitch corresponding to the pitch of the image sensor chips of an integrated circuit wafer, a cover layer having second apertures respectively axially aimed at the first apertures, and an optical layer sandwiched between the base layer and the cover layer having multiple optical lenses of which the optical axes pass through the first apertures and the second apertures, so that when one image capturing device of the image sensor chips of an integrated circuit wafer is adjusted to the image plane of one of the optical lenses and the wafer-level test module is set in alignment with the integrated circuit wafer horizontally and vertically, then the effective test light can be simultaneously projected onto the image capturing devices of the respective image sensor chips through the wafer-level test module to achieve an effective wafer-level test on multiple image sensor chips of the integrated

Abstract: A probe card for testing an image-sensing chip includes a circuit board having a first surface, a second surface, and an opening cut through the first and second surfaces for the passing of a test light, a guide member, and probes. The guide member is mounted on the second surface of the circuit board and provided with through holes. The probes each have a first end respectively electrically connected to the circuit board adjacent to the opening and a second end respectively inserted through the through holes of the guide member to the outside of the guide member for electrically connecting contacts of an image-sensing chip to be tested.

Abstract: A package module for an image sensing device is provided. The package module includes a substrate having thereon a photoelectric element array, a first optical element array formed on the photoelectric element array, a package lid having thereon a second optical element array opposite to the first optical element array and having an arrangement corresponding to that of the first optical element array; and a spacer disposed on a bonding area between the package lid and the substrate for adjusting a distance between the package lid and the substrate.

Abstract: A packing member for packing a wafer container in a carton for transportation includes a rectangular frame which has a receiving space, at least one recess disposed at an outer side thereof opposite to the receiving space, and retaining portions respectively projecting from an inner side of the rectangular frame into the receiving space, and support elements respectively protruding over the top and bottom surfaces of the rectangular frame.