Patents Assigned to Vishay BCcomponents Beyschlag GmbH
  • Patent number: 10354826
    Abstract: To produce a cost-effective fuse in chip design, which is applied to a carrier substrate made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor and a cover layer, in which the melting point of the metallic conductor may be defined reliably, it is suggested that an intermediate layer having low thermal conductivity be positioned between the carrier substrate and the metallic conductor, the intermediate layer being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer applied in island printing. Furthermore, a method for manufacturing the fuse is specified.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: July 16, 2019
    Assignee: Vishay BCcomponents Beyschlag GmbH
    Inventors: Werner Blum, Reiner Friedrich, Wolfgang Werner, Reimer Hinrichs
  • Publication number: 20130039380
    Abstract: A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.
    Type: Application
    Filed: July 16, 2012
    Publication date: February 14, 2013
    Applicant: Vishay BCcomponents Beyschlag GmbH
    Inventors: Wolfgang Werner, Joachim Aurich, Sascha Werth
  • Patent number: 8220988
    Abstract: A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.
    Type: Grant
    Filed: November 2, 2007
    Date of Patent: July 17, 2012
    Assignee: Vishay BCcomponents Beyschlag GmbH
    Inventors: Wolfgang Werner, Joachim Aurich, Sascha Werth