Patents Assigned to Vishay BCcomponents Beyschlag GmbH
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Patent number: 10354826Abstract: To produce a cost-effective fuse in chip design, which is applied to a carrier substrate made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor and a cover layer, in which the melting point of the metallic conductor may be defined reliably, it is suggested that an intermediate layer having low thermal conductivity be positioned between the carrier substrate and the metallic conductor, the intermediate layer being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer applied in island printing. Furthermore, a method for manufacturing the fuse is specified.Type: GrantFiled: June 13, 2016Date of Patent: July 16, 2019Assignee: Vishay BCcomponents Beyschlag GmbHInventors: Werner Blum, Reiner Friedrich, Wolfgang Werner, Reimer Hinrichs
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Patent number: 9899171Abstract: In order to provide a method for isolating a circuit and a thermal link, wherein the link has a very low resistance and is suitable for high currents, in particular very high short load currents, and also has a high degree of reliability, in particular under difficult conditions, such as thermal and mechanical loading which lasts for a relatively long time, for example, the invention proposes that, during the phase transition of the material of the fusible element (10) from the solid to the liquid state, the volume of the fusible element (10) increases and the pressure increases and, owing to the increase in volume and the increase in pressure, the fusible element (10) is dislodged so as to break the electrical connection.Type: GrantFiled: July 26, 2011Date of Patent: February 20, 2018Assignee: VISHAY BCcomponents BEYSCHLAG GmbHInventors: Joachim Aurich, Ulf Zum Felde, Bernd Krueger, Laurent Mex, Wolfgang Werner
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Publication number: 20160372293Abstract: To produce a cost-effective fuse in chip design, which is applied to a carrier substrate made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor and a cover layer, in which the melting point of the metallic conductor may be defined reliably, it is suggested that an intermediate layer having low thermal conductivity be positioned between the carrier substrate and the metallic conductor, the intermediate layer being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer applied in island printing. Furthermore, a method for manufacturing the fuse is specified.Type: ApplicationFiled: June 13, 2016Publication date: December 22, 2016Applicant: VISHAY BCcomponents BEYSCHLAG GmbHInventors: Werner Blum, Reiner Friedrich, Wolfgang Werner, Reimer Hinrichs
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Patent number: 9368308Abstract: In order to produce a cost-effective fuse in chip design, which is applied to a carrier substrate made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor and a cover layer, in which the melting point of the metallic conductor may be defined reliably, it is suggested that an intermediate layer having low thermal conductivity be positioned between the carrier substrate and the metallic conductor, the intermediate layer being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer applied in island printing. Furthermore, a method for manufacturing the fuse is specified.Type: GrantFiled: June 27, 2005Date of Patent: June 14, 2016Assignee: VISHAY BCcomponents BEYSCHLAG GmbHInventors: Werner Blum, Reiner Friedrich, Reimer Hinrichs, Wolfgang Werner
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Patent number: 9110002Abstract: A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.Type: GrantFiled: July 16, 2012Date of Patent: August 18, 2015Assignee: VISHAY BCCOMPONENTS BEYSCHLAG GMBHInventors: Wolfgang Werner, Joachim Aurich, Sascha Werth
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Publication number: 20130039380Abstract: A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.Type: ApplicationFiled: July 16, 2012Publication date: February 14, 2013Applicant: Vishay BCcomponents Beyschlag GmbHInventors: Wolfgang Werner, Joachim Aurich, Sascha Werth
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Patent number: 8220988Abstract: A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.Type: GrantFiled: November 2, 2007Date of Patent: July 17, 2012Assignee: Vishay BCcomponents Beyschlag GmbHInventors: Wolfgang Werner, Joachim Aurich, Sascha Werth
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Publication number: 20100054299Abstract: A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.Type: ApplicationFiled: November 2, 2007Publication date: March 4, 2010Applicant: VISHAY BCCOMPONENTS BEYSCHLAG GMBHInventors: Wolfgang Werner, Joachim Aurich, Sascha Werth
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Publication number: 20080303626Abstract: In order to produce a cost-effective fuse (100) in chip design, which is applied to a carrier substrate (10) made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor (13) and a cover layer (14), in which the melting point of the metallic conductor (13) may be defined reliably, it is suggested that an intermediate layer (11) having low thermal conductivity be positioned between the carrier substrate (10) and the metallic conductor (13), the intermediate layer (11) being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer (11) applied in island printing. Furthermore, a method for manufacturing the fuse (100) is specified.Type: ApplicationFiled: June 27, 2005Publication date: December 11, 2008Applicant: VISHAY BCcomponents BEYSCHLAG GmbHInventors: Werner Blum, Reiner Friedrich, Reimer Hinrichs, Wolfgang Werner