Patents Assigned to Vishay Intertechnology
  • Patent number: 6892443
    Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: May 17, 2005
    Assignee: Vishay Intertechnology
    Inventors: Joseph Szwarc, Reuven Goldstein
  • Publication number: 20050083170
    Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.
    Type: Application
    Filed: October 18, 2004
    Publication date: April 21, 2005
    Applicant: Vishay Intertechnology
    Inventors: Joseph Szwarc, Reuven Goldstein
  • Publication number: 20040159162
    Abstract: An improved strain gage is disclosed. The strain gage includes a semi-rigid substrate having a thickness of about 1 to about 30 mils, a resistive strain sensitive foil bonded to the semi-rigid substrate for providing a resistance varying with strain associated with a surface to which the strain gage is attached, and a first and a second terminal operatively connected to the resistive strain sensitive foil.
    Type: Application
    Filed: February 19, 2003
    Publication date: August 19, 2004
    Applicant: Vishay Intertechnology
    Inventors: Thomas Patrick Kieffer, Robert Barry Watson, Sharon Lee Karcher Harris
  • Publication number: 20040150505
    Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power.
    Type: Application
    Filed: January 22, 2004
    Publication date: August 5, 2004
    Applicant: Vishay Intertechnology
    Inventors: Joseph Szwarc, Reuven Goldstein
  • Publication number: 20040100356
    Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.
    Type: Application
    Filed: November 25, 2002
    Publication date: May 27, 2004
    Applicant: Vishay Intertechnology
    Inventors: Joseph Szwarc, Reuven Goldstein