Patents Assigned to Vishay Sprague, Inc.
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Patent number: 7161797Abstract: A surface mount capacitor (10) and method for making the same. A solid slug or pellet anode body (1) is encapsulated in a case (6) of insulating material. An anode and cathode termination pair (2, 3) are formed with surface mount mounting portions on one side of the case (6). An electrical connection (4) is made from the cathode termination (2) to a cathode on pellet (1) through the case (6). An electrical connection (7) is made between an anode associated with the pellet (1) and the anode termination (3) externally of the case (6). The external connection (7) allows improved volumetric efficiency by freeing up space in the case (6) for a bigger pellet (1).Type: GrantFiled: May 17, 2005Date of Patent: January 9, 2007Assignee: Vishay Sprague, Inc.Inventors: Pavel Vaisman, Alex Eidelman, Yuri Stangrit, Leonid Vasserman
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Publication number: 20060260109Abstract: A surface mount capacitor (10) and method for making the same. A solid slug or pellet anode body (1) is encapsulated in a case (6) of insulating material. An anode and cathode termination pair (2, 3) are formed with surface mount mounting portions on one side of the case (6). An electrical connection (4) is made from the cathode termination (2) to a cathode on pellet (1) through the case (6). An electrical connection (7) is made between an anode associated with the pellet (1) and the anode termination (3) externally of the case (6). The external connection (7) allows improved volumetric efficiency by freeing up space in the case (6) for a bigger pellet (1).Type: ApplicationFiled: November 4, 2005Publication date: November 23, 2006Applicant: VISHAY SPRAGUE, INC.Inventors: Pavel Vaisman, Alex Eidelman, Yuri Stangrit, Leonid Vasserman
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Publication number: 20060262489Abstract: A surface mount capacitor (10) and method for making the same. A solid slug or pellet anode body (1) is encapsulated in a case (6) of insulating material. An anode and cathode termination pair (2, 3) are formed with surface mount mounting portions on one side of the case (6). An electrical connection (4) is made from the cathode termination (2) to a cathode on pellet (1) through the case (6). An electrical connection (7) is made between an anode associated with the pellet (1) and the anode termination (3) externally of the case (6). The external connection (7) allows improved volumetric efficiency by freeing up space in the case (6) for a bigger pellet (1).Type: ApplicationFiled: May 17, 2005Publication date: November 23, 2006Applicant: VISHAY SPRAGUE, INC.Inventors: Pavel Vaisman, Alex Eidelman, Yuri Stangrit, Leonid Vasserman
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Patent number: 7088573Abstract: The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.Type: GrantFiled: March 2, 2004Date of Patent: August 8, 2006Assignee: Vishay Sprague, Inc.Inventor: Haim Goldberger
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Patent number: 7085127Abstract: The surface mount chip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount chip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount chip capacitor of the present invention is created by methods which include the steps of forming a wire and placing conductive powder upon the wire. An embodiment of the present invention, presses the wire from a foil sheet and electrophoretically depositing the conductive powder element upon the wire.Type: GrantFiled: March 2, 2004Date of Patent: August 1, 2006Assignee: Vishay Sprague, Inc.Inventors: Haim Goldberger, Alex Eidelman, Anatoly Agulyansky, Ilia Skatkov
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Publication number: 20060104007Abstract: The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.Type: ApplicationFiled: October 26, 2005Publication date: May 18, 2006Applicant: Vishay Sprague, Inc.Inventor: Haim Goldberger
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Publication number: 20060061939Abstract: The surface mount chip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount chip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount chip capacitor of the present invention is created by methods which include the steps of forming a wire and placing conductive powder upon the wire. An embodiment of the present invention, presses the wire from a foil sheet and electrophoretically depositing the conductive powder element upon the wire.Type: ApplicationFiled: November 3, 2005Publication date: March 23, 2006Applicant: Vishay Sprague, Inc.Inventors: Haim Goldberger, Alex Eidelman, Anatoly Agulyansky, IIia Skatkov
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Publication number: 20060056134Abstract: The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.Type: ApplicationFiled: November 2, 2005Publication date: March 16, 2006Applicant: Vishay Sprague, Inc.Inventor: Haim Goldberger
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Publication number: 20050195558Abstract: The surface mount chip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount chip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount chip capacitor of the present invention is created by methods which include the steps of forming a wire and placing conductive powder upon the wire. An embodiment of the present invention, presses the wire from a foil sheet and electrophoretically depositing the conductive powder element upon the wire.Type: ApplicationFiled: March 2, 2004Publication date: September 8, 2005Applicant: Vishay Sprague, Inc.Inventors: Haim Goldberger, Alex Eidelman, Anatoly Agulyansky, IIia Skatkov
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Publication number: 20050195553Abstract: The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.Type: ApplicationFiled: March 2, 2004Publication date: September 8, 2005Applicant: Vishay Sprague, Inc.Inventor: Haim Goldberger
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Patent number: 6914770Abstract: The surface mount flipchip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount flipchip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending below the conductive powder element. A first terminal is formed on the surface mount flipchip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount flipchip capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. One embodiment of the present invention creates multiple wires from a foil sheet and electrophoretically deposits conductive powder element upon the wire.Type: GrantFiled: March 2, 2004Date of Patent: July 5, 2005Assignee: Vishay Sprague, Inc.Inventor: Haim Goldberger
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Patent number: 6541302Abstract: A method for forming terminations on the opposite ends of a chip component includes placing a chip component in a cavity with one end of the chip component exposed. Termination conductive material is then deposited on the exposed end of the chip component and the component is removed from the cavity and reversed. Termination material is then deposited on the other exposed end. One modification of the invention includes extending the chip components completely through holes in a plate so that the opposite ends of the chip component are exposed. The termination material is then placed on the opposite ends of the chip component.Type: GrantFiled: January 11, 2001Date of Patent: April 1, 2003Assignee: Vishay Sprague, Inc.Inventors: Johann Huber, John Yates Cadwallader
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Patent number: 6483693Abstract: A first mold die and a second mold die are moved together and are shaped to define a mold cavity therebetween. A capacitor pellet is positioned within the mold cavity and a plurality of projections extend inwardly to engage the capacitor pellet and hold it spaced away from the cavity side wall.Type: GrantFiled: March 15, 2001Date of Patent: November 19, 2002Assignee: Vishay Sprague, Inc.Inventors: Tibor Kormendy, Michel J. Richard, John Y. Cadwallader, Kyle E. Clark
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Patent number: 6447570Abstract: A pellet for use in electrolytic capacitors is comprised of a powder selected from one of Tantalum and Niobium. The pellet is porous, free from oxygen, annealed by heat, and diffused with nitrogen with all these attributes being achieved in an oxygen free environment. The method of producing the pellet involves the steps of taking a powder selected from one of Tantalum and Niobium pressing the powder into a self-contained pellet; removing any oxygen in the pellet; annealing the pellet; and subjecting the pellet to nitrogen gas so that the nitrogen diffuses into the pellet to reduce DLC, with all these steps taking place in an oxygen free environment.Type: GrantFiled: November 30, 2000Date of Patent: September 10, 2002Assignee: Vishay Sprague, Inc.Inventor: Yuri L. Pozdeev-Freeman
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Patent number: 6410083Abstract: A method of doping tantalum and niobium pellets with nitrogen is described wherein the resulting pellets are substantially free of nitride precipitate on their outer surfaces. The method includes the step of heating the pellets to a temperature of from about 600-1400° C. in a nitrogen gas atmosphere and then in a vacuum which causes nitrogen contacting a pellet to diffuse into the inner portion of the pellet instead of forming a precipitate. The resulting pellets have improved DCL stability and reliability in comparison to prior art nitrogen-doped tantalum and niobium pellets.Type: GrantFiled: February 25, 2000Date of Patent: June 25, 2002Assignee: Vishay Sprague, Inc.Inventor: Yuri L. Pozdeev-Freeman
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Patent number: 6411499Abstract: A capacitor includes a pellet molded within a protective material and having a cathode termination surface at one end and an anode wire extending from the other end. The cathode termination surface is centered with respect to the longitudinal axis of the capacitor. The method includes centering the pellet body and a tear drop shaped conductive cathode element within a mold and molding a protective coating around them. After the molding is complete a portion of the tear drop shaped member is removed to create a cathode termination.Type: GrantFiled: April 25, 2001Date of Patent: June 25, 2002Assignee: Vishay Sprague, Inc.Inventors: Tibor Kormendy, Michel J. Richard, John Y. Cadwallader, Kyle E. Clark
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Patent number: 6380577Abstract: The tantalum chip capacitor of the present invention includes a anode terminal which is substantially flat. The tantalum wire which extends from the tantalum pellet through the insulating material terminates substantially flush with the insulating material, allowing the termination materials to be applied over a substantially flat surface. The tantalum chip capacitors of the present invention are created by methods which include the step of grinding the anode end of the capacitor so that the tantalum wire is flush with the insulating material. Conductive materials can then be applied to the anode end of the capacitor creating a substantially flat anode terminal.Type: GrantFiled: July 7, 2000Date of Patent: April 30, 2002Assignee: Vishay Sprague, Inc.Inventor: John Yates Cadwallader
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Patent number: 6368364Abstract: A capacitor includes a pellet molded within a protective material and having a cathode termination surface at one end and an anode wire extending from the other end. The cathode termination surface is centered with respect to the longitudinal axis of the capacitor. The method includes centering the pellet body and a tear drop shaped conductive cathode element within a mold and molding a protective coating around them. After the molding is complete a portion of the tear drop shaped member is removed to create a cathode termination.Type: GrantFiled: May 23, 2000Date of Patent: April 9, 2002Assignee: Vishay Sprague, Inc.Inventors: Tibor Kormendy, Michel J. Richard, John Y. Cadwallader, Kyle E. Clark
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Patent number: 6319292Abstract: A capacitor includes a porous pellet formed from compressed conductive particles. The pellet has a lead receiving external surface. The conductive particles at the lead receiving surface are fused together to create a fused layer on the external surface of the pellet. A lead wire has one of its ends welded to the fused layer on the surface of the pellet. The fused layer is formed by exposing it to high temperatures, preferably by use of a laser beam.Type: GrantFiled: June 5, 2000Date of Patent: November 20, 2001Assignee: Vishay Sprague, Inc.Inventors: Yuri L. Pozdeev-Freeman, Boris Levi, Semion Akselrod
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Patent number: 6284555Abstract: A first mold die and a second mold die are moved together and are shaped to define a mold cavity therebetween. A capacitor pellet is positioned within the mold cavity and a plurality of projections extend inwardly to engage the capacitor pellet and hold it spaced away from the cavity side wall. The method comprises placing the pellet body within the cavity molding and retentively engaging the pellet body with a plurality of projections to provide a space between the pellet body and the cavity side wall. A molding material is used to fill the space to provide a coating on the pellet body.Type: GrantFiled: May 23, 2000Date of Patent: September 4, 2001Assignee: Vishay Sprague, Inc.Inventors: Tibor Kormendy, Michel J. Richard, John Y. Cadwallader, Kyle E. Clark