Abstract: An electronic circuit assembly having anti-tombstoning solder joints, including: a substrate 10 having at least one mounting pad 20 thereon; an SMD 30 having at least one termination 40; and at least one solder joint 50 connecting each termination 40 to its respective mounting pad 20. Each solder joint 50 is convex in shape, having a continuous and substantially circular arcuate outer profile 60 and covering substantially all of the mounting pad 20 and substantially all of a top portion 42 of each termination 40. Each mounting pad 20 has a predetermined length lp and each solder joint has a predetermined volume of solder selected such that a positive net anti-tombstoning moment is exerted upon the SMD 30 when at least one solder joint 50 is in a molten state.
Type:
Grant
Filed:
June 25, 1997
Date of Patent:
October 16, 2001
Assignee:
Visteon Global Tech.
Inventors:
Vivek Amir Jairazbhoy, Richard Keith McMillan, II
Abstract: An alternator assembly 10 having a pair of housing members 11, 12 which cooperatively contain a stator 24, rotor 18, and bearing 29. The housing member 12 includes an integrally formed bearing sleeve member 40 which receives the bearing 29 and allows the rotor 18 to rotate within the assembly 10.
Type:
Grant
Filed:
December 23, 1999
Date of Patent:
August 21, 2001
Assignee:
Visteon Global Tech.
Inventors:
Dave Linden, Jayeson Fougner, Kevin Roy Harpenau, Steven John Yockey