Abstract: An apparatus for testing bonding strength of electrical connection comprises a platform including a two-axis drive, a device holder positioned on the two-axis drive and configured to receive an electronic device, a vertical drive positioned on the platform, a cantilever positioned on the vertical drive, and a test head connected in a rotational manner with the cantilever. A frictionless calibration device for shear force testing comprises a base, two supporters positioned on the base, a shaft having two tapering ends positioned between the two supporters, and a calibration member fixed on the shaft, wherein the shaft and the calibration member contact the supporters in a rotational manner.
Type:
Grant
Filed:
May 15, 2009
Date of Patent:
February 19, 2013
Assignee:
Viswell Technology Co., Ltd.
Inventors:
Chia Ho Su, Wen Sheng Lin, Cheng Chieh Chen
Abstract: An apparatus for testing bonding strength of electrical connection comprises a platform including a two-axis drive, a device holder positioned on the two-axis drive and configured to receive an electronic device, a vertical drive positioned on the platform, a cantilever positioned on the vertical drive, and a test head connected in a rotational manner with the cantilever. A frictionless calibration device for shear force testing comprises a base, two supporters positioned on the base, a shaft having two tapering ends positioned between the two supporters, and a calibration member fixed on the shaft, wherein the shaft and the calibration member contact the supporters in a rotational manner.
Type:
Application
Filed:
May 15, 2009
Publication date:
November 18, 2010
Applicant:
VISWELL TECHNOLOGY CO., LTD
Inventors:
CHIA HO SU, WEN SHENG LIN, CHENG CHIEH CHEN
Abstract: An optical imaging apparatus for inspecting a solar cell includes a power supply configured to apply a reverse biased voltage to the solar cell such that shunt defects in the solar cell will generate heat, a thermal imaging device configured to obtain the thermal image of the solar cell, a computing unit including a thermal image analysis module configured to identify hot spots in the thermal image, a locating module configured to locate the center positions of the hot spots, a visible image analysis module configured to identify the defect features of the hot spots, and a visible light imaging device configured to acquire visible images of the hot spots.
Type:
Application
Filed:
July 8, 2008
Publication date:
September 24, 2009
Applicant:
VISWELL TECHNOLOGY CO., LTD
Inventors:
CHIA HO SU, WEN SHENG LIN, KUANG YU CHEN