Patents Assigned to Vitex Systems, Inc.
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Publication number: 20110154854Abstract: An evaporator includes a vaporization chamber having a monomer inlet and a vapor outlet. There is a vapor nozzle in the vapor outlet. The evaporator also includes a collar positioned between the vaporization chamber and the vapor nozzle which increases the pressure in the evaporation chamber while the conductance through the nozzle is substantially unchanged.Type: ApplicationFiled: December 31, 2009Publication date: June 30, 2011Applicant: VITEX SYSTEMS, INC.Inventors: Damien Boesch, Martin Rosenblum
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Patent number: 7767498Abstract: A method of encapsulating an environmentally sensitive device. The method includes providing a substrate; placing at least one environmentally sensitive device adjacent to the substrate; and depositing at least one barrier stack adjacent to the environmentally sensitive device, the at least one barrier stack comprising at least one barrier layer and at least one polymeric decoupling layer, wherein the at least one polymeric decoupling layer is made from at least one polymer precursor, and wherein the polymeric decoupling layer has at least one of: a reduced number of polar regions; a high packing density; a reduced number of regions that have bond energies weaker than a C—C covalent bond; a reduced number of ester moieties; increased Mw of the at least one polymer precursor; increased chain length of the at least one polymer precursor; or reduced conversion of C?C bonds. An encapsulated environmentally sensitive device is also described.Type: GrantFiled: August 24, 2006Date of Patent: August 3, 2010Assignee: Vitex Systems, Inc.Inventors: Lorenza Moro, Todd L. Krajewski
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Publication number: 20100167002Abstract: Methods of sealing environmentally sensitive devices and vacuum insulation panels are described. One method includes: providing first and second substrates; placing the environmentally sensitive device between the first and second substrates; sealing the first and second substrates together with an adhesive, the adhesive having an exposed portion; and covering the exposed portion of the adhesive with a barrier layer, or with a barrier stack comprising at least one decoupling layer and at least one barrier layer.Type: ApplicationFiled: December 30, 2008Publication date: July 1, 2010Applicant: Vitex Systems, Inc.Inventors: Xi Chu, Chyi-Shan Suen, Robert Jan Visser
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Publication number: 20100156277Abstract: Methods of making an integrated barrier stack and optical enhancement layer for protecting and improving the light out coupling of an encapsulated OLED are described. The method includes optimizing the thickness of various layers including the initial inorganic barrier layer and the inorganic barrier layer and polymeric decoupling layer for the barrier stack. The thickness is optimized for at least one of maximum efficiency, minimum dispersion, or minimum spectral shift so that the encapsulated OLED has enhanced light outcoupling compared to the bare OLED.Type: ApplicationFiled: December 22, 2008Publication date: June 24, 2010Applicant: VITEX SYSTEMS, INC.Inventors: Robert Jan Visser, Lorenza Moro
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Publication number: 20100159792Abstract: Methods of making an integrated barrier stack and optical enhancement layer for protecting and improving the light out coupling of encapsulated white OLEDs are described. The method includes optimizing the thickness of various layers including one or more of the plasma protective layer, the initial organic layer, the initial inorganic barrier layer, and the inorganic barrier layer and polymeric decoupling layer for the barrier stack. The thickness is optimized for at least one of total efficiency, or intentional color point shift so that the encapsulated OLED has enhanced light outcoupling compared to the bare OLED.Type: ApplicationFiled: December 22, 2008Publication date: June 24, 2010Applicant: VITEX SYSTEMS, INC.Inventors: Robert Jan Visser, Lorenza Moro
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Patent number: 7727601Abstract: An edge-sealed, encapsulated environmentally sensitive device. The device includes an environmentally sensitive device, and at least one edge-sealed barrier stack. The edge-sealed barrier stack includes a decoupling layer and at least two barrier layers. The environmentally sensitive device is sealed between an edge-sealed barrier stack and either a substrate or another edge-sealed barrier stack. A method of making the edge-sealed, encapsulated environmentally sensitive device is also disclosed.Type: GrantFiled: March 29, 2007Date of Patent: June 1, 2010Assignee: Vitex Systems, Inc.Inventors: Paul E. Burrows, Eric S. Mast, Peter M. Martin, Gordon L. Graff, Mark E. Gross, Charles C. Bonham, Wendy D. Bennett, Michael G. Hall
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Patent number: 7648925Abstract: An improved barrier stack. The barrier stack is made by the process of depositing the polymeric decoupling layer on a substrate; depositing a first inorganic layer on the decoupling layer under a first set of conditions wherein an ion and neutral energy arriving at the substrate is less than about 20 eV so that the first inorganic layer is not a barrier layer, wherein a temperature of the substrate is less than about 150° C.; and depositing a second inorganic layer on the first inorganic layer under a second set of conditions wherein an ion and neutral energy arriving at the substrate is greater than about 50 eV so that the second inorganic layer is a barrier layer. Methods of reducing damage to a polymeric layer in a barrier stack are also described.Type: GrantFiled: July 12, 2007Date of Patent: January 19, 2010Assignee: Vitex Systems, Inc.Inventors: Lorenza Moro, Xi Chu
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Publication number: 20090208754Abstract: A method of making an edge-sealed, encapsulated environmentally sensitive device. The method includes providing an environmentally sensitive device on a substrate; depositing a decoupling layer through one mask, the decoupling layer adjacent to the environmentally sensitive device, the decoupling layer having a discrete area and covering the environmentally sensitive device; increasing the distance between the one mask and the substrate; and depositing a first barrier layer through the one mask, the first barrier layer adjacent to the decoupling layer, the first barrier layer having an area greater than the discrete area of the decoupling layer and covering the decoupling layer, the decoupling layer being sealed between the edges of the first barrier layer and the substrate or an optional second barrier layer.Type: ApplicationFiled: December 30, 2008Publication date: August 20, 2009Applicant: VITEX SYSTEMS, INC.Inventors: Xi Chu, Paul E. Burrows, Eric S. Mast, Peter M. Martin, Gordon L. Graff, Mark E. Gross, Charles C. Bonham, Wendy D. Bennett, Michael G. Hall, Martin Philip Rosenblum
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Publication number: 20090191342Abstract: Methods of making an edge-sealed, encapsulated environmentally sensitive device. One method includes providing an environmentally sensitive device with a contact on a substrate; depositing a decoupling layer adjacent to the environmentally sensitive device, the decoupling layer having a discrete area and covering the environmentally sensitive device and not covering the contact, the decoupling layer deposited using a printing process; depositing a first barrier layer adjacent to the decoupling layer, the first barrier layer having a first area greater than the discrete area of the decoupling layer, and the first barrier layer having a second area covering the decoupling layer and the contact, the decoupling layer being sealed between the edges of the first barrier layer and the substrate or an optional second barrier layer; and removing the second area of the first barrier layer from the contact.Type: ApplicationFiled: December 30, 2008Publication date: July 30, 2009Applicant: VITEX SYSTEMS, INC.Inventors: Xi Chu, Paul E. Burrows, Eric S. Mast, Peter M. Martin, Gordon L. Graff, Mark E. Gross, Charles C. Bonham, Wendy D. Bennett, Michael G. Hall, Martin Philip Rosenblum
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Patent number: 7510913Abstract: A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes; and depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by the plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer. An encapsulated plasma sensitive device is also described.Type: GrantFiled: May 23, 2006Date of Patent: March 31, 2009Assignee: Vitex Systems, Inc.Inventors: Lorenza Moro, Xi Chu, Martin Philip Rosenblum, Kenneth Jeffrey Nelson, Paul E. Burrows, Mark E. Gross, Mac R. Zumhoff, Peter M. Martin, Charles C. Bonham, Gordon L. Graff
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Publication number: 20070281174Abstract: An improved barrier stack. The barrier stack is made by the process of depositing the polymeric decoupling layer on a substrate; depositing a first inorganic layer on the decoupling layer under a first set of conditions wherein an ion and neutral energy arriving at the substrate is less than about 20 eV so that the first inorganic layer is not a barrier layer, wherein a temperature of the substrate is less than about 150° C.; and depositing a second inorganic layer on the first inorganic layer under a second set of conditions wherein an ion and neutral energy arriving at the substrate is greater than about 50 eV so that the second inorganic layer is a barrier layer. Methods of reducing damage to a polymeric layer in a barrier stack are also described.Type: ApplicationFiled: July 12, 2007Publication date: December 6, 2007Applicant: Vitex Systems, Inc.Inventors: Lorenza Moro, Xi Chu
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Patent number: 7198832Abstract: An edge-sealed, encapsulated environmentally sensitive device. The device includes at least one initial barrier stack, an environmentally sensitive device, and at least one additional barrier stack. The barrier stacks include at least one decoupling layer and at least one barrier layer. The environmentally sensitive device is sealed between the at least one initial barrier stack and the at least one additional barrier stack. A method of making the edge-sealed, encapsulated environmentally sensitive device is also disclosed.Type: GrantFiled: April 22, 2005Date of Patent: April 3, 2007Assignee: Vitex Systems, Inc.Inventors: Paul E. Burrows, Eric S. Mast, Peter M. Martin, Gordon L. Graff, Mark E. Gross
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Publication number: 20070049155Abstract: A method of encapsulating an environmentally sensitive device. The method includes providing a substrate; placing at least one environmentally sensitive device adjacent to the substrate; and depositing at least one barrier stack adjacent to the environmentally sensitive device, the at least one barrier stack comprising at least one barrier layer and at least one polymeric decoupling layer, wherein the at least one polymeric decoupling layer is made from at least one polymer precursor, and wherein the polymeric decoupling layer has at least one of: a reduced number of polar regions; a high packing density; a reduced number of regions that have bond energies weaker than a C—C covalent bond; a reduced number of ester moieties; increased Mw of the at least one polymer precursor; increased chain length of the at least one polymer precursor; or reduced conversion of C?C bonds. An encapsulated environmentally sensitive device is also described.Type: ApplicationFiled: August 24, 2006Publication date: March 1, 2007Applicant: Vitex Systems, Inc.Inventors: Lorenza Moro, Todd Krajewski
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Patent number: 6866901Abstract: An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barrier layers has an area greater than the area of one of the decoupling layers. The decoupling layer is sealed by the first barrier layer within the area of barrier material. An edge-sealed, encapsulated environmentally sensitive device is provided. A method of making the edge-sealed barrier film composite is also provided.Type: GrantFiled: September 28, 2001Date of Patent: March 15, 2005Assignee: Vitex Systems, Inc.Inventors: Paul E. Burrows, J. Chris Pagano, Eric S. Mast, Peter M. Martin, Gordon L. Graff, Mark E. Gross
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Publication number: 20030203210Abstract: A multi-layer barrier coating on a flexible substrate exhibits improved resistance to gas and liquid permeation. The multi-layer barrier coating generally comprises alternating polymer and inorganic layers, and the layer immediately adjacent to the flexible substrate and the topmost isolation layer may both be inorganic layers. The surface of each deposited inorganic layers may be plasma-treated prior to the deposition of the polymer layer thereon, while the surfaces of the polymer layers are generally not plasma-treated.Type: ApplicationFiled: April 30, 2002Publication date: October 30, 2003Applicant: Vitex Systems, Inc.Inventors: Gordon Lee Graff, Mark Edward Gross, Wendy D. Bennett, Michael Gene Hall, Peter Maclyn Martin, Eric Sidney Mast, John Chris Pagano, Nicole Rutherford, Mac R. Zumhoff