Abstract: A wearable thermometer patch for monitoring healing of a wound on a user's skin includes a circuit substrate comprising an electric circuit and a plurality of temperature probe units distributed in a two-dimensional array. Each of the plurality of temperature probe units can include a temperature sensor in electric connection with the electric circuit in the circuit substrate. The plurality of temperature probe units can measure temperature values on a user's skin at different positions defined by the two-dimensional array.

Abstract: An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and first one or more conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.

Abstract: A wearable thermometer patch includes a substrate and a temperature probe unit mounted in the substrate and configured to measure temperature of a user's skin. The temperature probe unit includes a force sensor configured to measure contact force between the temperature probe unit and the user' skin, a plate, a first temperature sensor attached to a lower surface of the plate, and a second temperature sensor attached to an upper surface of the plate.

Abstract: A multi-purpose wearable patch includes a stretchable and permeable substrate, a first sensing unit mounted in the stretchable and permeable substrate, the sensing unit that can conduct a first measurement of a user to produce a first measurement signal, a treatment unit that produces a first treatment field in the user's body; a circuit electrically connected with the treatment unit and the sensing unit; and a semiconductor chip in connection with the circuit and configured to receive the first measurement signal from the sensing unit. The semiconductor chip produces a first treatment control signal to control the treatment unit to produce a first treatment field in the user's body.

Abstract: A dual purpose wearable patch includes a stretchable and permeable substrate, a sensing unit mounted in the stretchable and permeable substrate, wherein the sensing unit can conduct a measurement of a user to produce a measurement signal, one or more electrodes respectively attached to the stretchable and permeable substrate, a circuit substrate on the stretchable and permeable substrate, wherein the circuit substrate includes a circuit electrically connected with the one or more electrodes and the sensing unit, and a semiconductor chip mounted on the circuit substrate and in connection with the circuit. The semiconductor chip can receive the measurement signal from the sensing unit and can produce a treatment control signal to control the one or more electrodes to apply a voltage across the user's body.

Abstract: A wearable thermometer patch for monitoring healing of a wound on a user's skin includes a circuit substrate comprising an electric circuit and a plurality of temperature probe units distributed in a two-dimensional array. Each of the plurality of temperature probe units can include a temperature sensor in electric connection with the electric circuit in the circuit substrate. The plurality of temperature probe units can measure temperature values on a user's skin at different positions defined by the two-dimensional array.

Abstract: An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and a first group of conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first group of one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first group of conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.

Abstract: A wearable patch capable of wireless communications includes an elastic layer, an adhesive layer under the elastic layer, and a shearable electrode layer that includes: a support substrate comprising one or more openings so positioned to allow the shearable electrode layer to be sheared and elongated, and breathable, an upper electrode layer on the support substrate, and a lower electrode layer under the support substrate. The support substrate can include a via that is conductively connected to the upper electrode layer and the lower electrode layer. The lower electrode can be in contact with a user's body and to pick up electric signals from the user's body.

Abstract: A wearable patch capable of wireless communications includes an adhesive layer, and a shearable circuit layer comprising a support substrate comprising one or more openings on the adhesive layer, wherein the one or more openings in the support substrate are so positioned to allow the shearable circuit layer to be sheared and elongated, and breathable. A conductive circuit is embedded in the support substrate. One or more semiconductor chips are in connection with the conductive circuit. An elastic layer is positioned on the shearable circuit layer. The one or more semiconductor chips and the conductive circuit can wirelessly communicate with an external device.

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

Abstract: A wearable patch capable of wireless communications includes an adhesive layer, and a shearable circuit layer comprising a support substrate comprising one or more openings on the adhesive layer, wherein the one or more openings in the support substrate are so positioned to allow the shearable circuit layer to be sheared and elongated, and breathable. A conductive circuit is embedded in the support substrate. One or more semiconductor chips are in connection with the conductive circuit. An elastic layer is positioned on the shearable circuit layer. The one or more semiconductor chips and the conductive circuit can wirelessly communicate with an external device.

Abstract: A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.

Abstract: An electronic patch includes a first circuit layer comprising a substantially flat first substrate and a first conductive circuit, a second circuit layer comprising a substantially flat second substrate and a second conductive circuit, and an undulated ribbon that connects the first circuit layer and the second circuit layer. The undulated ribbon includes a third conductive circuit that connects the first conductive circuit and the second conductive circuit. An elastic layer encloses the first circuit layer, the second circuit layer, and the undulated ribbons.

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.