Abstract: A wearable tag capable of wireless communications includes a first elastic layer, a second elastic layer over the first elastic layer, wherein the second elastic layer is embedded with a first conductive circuit. The wearable tag includes a dielectric layer on the second elastic layer, a third elastic layer on the dielectric layer, wherein the third elastic layer is embedded with a second conductive circuit, wherein the dielectric layer comprises via holes that contain electric connections between the semiconductor chip and the first conductive circuit. A semiconductor chip is in connection with the first conductive circuit and the second conductive circuit, wherein the semiconductor chip, the first conductive circuit, and the second conductive circuit are configured to wirelessly communicate with external devices. The wearable tag also includes a fourth elastic layer on the semiconductor chip.

Abstract: A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.

Abstract: A wearable tag capable of wireless communications includes a first elastic layer, a second elastic layer over the first elastic layer, wherein the second elastic layer is embedded with a first conductive circuit. The wearable tag includes a dielectric layer on the second elastic layer, a third elastic layer on the dielectric layer, wherein the third elastic layer is embedded with a second conductive circuit, wherein the dielectric layer comprises via holes that contain electric connections between the semiconductor chip and the first conductive circuit. A semiconductor chip is in connection with the first conductive circuit and the second conductive circuit, wherein the semiconductor chip, the first conductive circuit, and the second conductive circuit are configured to wirelessly communicate with external devices. The wearable tag also includes a fourth elastic layer on the semiconductor chip.