Abstract: A VCSEL package including a VCSEL, a housing, containing the VCSEL, and a diffuser operably attached to the housing and configured to receive an emitted beam of light from the VCSEL and produce a beam of predetermined angular divergence. The housing may be a PLLC package, a ceramic package, or a TO-style package. The diffuser could be a substantially planar diffuser sheet, which in some cases may be comprised of glass or plastic. In some embodiments, the diffuser could be a diffractive optical element or holographic light shaping diffuser. In some embodiments, the diffuser can be designed to produce a beam with an illumination full angle of up to about 90 degrees.
Abstract: The present disclosure relates to novel and advantageous VCSELs and VCSEL arrays. In particular, the present disclosure relates to novel and advantageous VCSELs and VCSEL arrays having, or patterned in, unique shapes, including rectangular shapes, linear shapes, shapes having two or more segments, and other non-circular shapes. Additionally, VCSELs and VCSEL arrays of the present disclosure may be combined with optical elements. In some embodiments, optical elements may be monolithically integrated on the VCSEL dies, or may be monolithically integrated on standoff pedestals arranged on the VCSEL dies.
Type:
Application
Filed:
April 5, 2018
Publication date:
October 18, 2018
Applicant:
Vixar
Inventors:
Matthew M. Dummer, Klein L. Johnson, Mary K. Brenner
Abstract: Plastic optical fiber data communication links. Particularly, plastic optical fiber data communication links for embedded applications. More particularly, unique packaging approaches to constructing a very small, low cost, but high performance optical link, which may operate at 1 gigabits per second (Gbps) or faster.
Type:
Grant
Filed:
May 14, 2014
Date of Patent:
August 22, 2017
Assignee:
Vixar
Inventors:
Mary Brenner, Klein Johnson, William Hogan, Dave Shelander
Abstract: VCSEL apparatus having a substrate, a solid-state gain medium, a reflective mirror on one side of the medium, a movable reflective mirror on an opposite side of the medium, and a mechanism configured to move the movable mirror to tune a characteristic wavelength. Also described is a VCSEL apparatus having a silicon substrate having a slot therethrough and electrical connections formed on a first face, a substrate having VCSELs thereon and mounted across the slot and electrically connected to the electrical connections on the silicon substrate, and a glass substrate affixed to a second face of the silicon substrate. Also described is a VCSEL apparatus having a graded-index lens array having GRIN lenses mounted adjacently in a staggered arrangement, a PCB mounted to the lens array, and VCSEL chips mounted adjacently on the PCB and arranged so as to emit laser light through the lenses.
Type:
Grant
Filed:
December 28, 2012
Date of Patent:
March 24, 2015
Assignee:
Vixar
Inventors:
Matthew M. Dummer, William Hogan, Mary K. Hibbs-Brenner, Klein L. Johnson, Garrett D. Cole
Abstract: Plastic optical fiber data communication links. Particularly, plastic optical fiber data communication links for embedded applications. More particularly, unique packaging approaches to constructing a very small, low cost, but high performance optical link, which may operate at 1 gigabits per second (Gbps) or faster.
Type:
Application
Filed:
May 14, 2014
Publication date:
November 20, 2014
Applicant:
Vixar
Inventors:
Mary Brenner, Klein Johnson, William Hogan, Dave Shelander
Abstract: VCSEL apparatus having a substrate, a solid-state gain medium, a reflective mirror on one side of the medium, a movable reflective mirror on an opposite side of the medium, and a mechanism configured to move the movable mirror to tune a characteristic wavelength. Also described is a VCSEL apparatus having a silicon substrate having a slot therethrough and electrical connections formed on a first face, a substrate having VCSELs thereon and mounted across the slot and electrically connected to the electrical connections on the silicon substrate, and a glass substrate affixed to a second face of the silicon substrate. Also described is a VCSEL apparatus having a graded-index lens array having GRIN lenses mounted adjacently in a staggered arrangement, a PCB mounted to the lens array, and VCSEL chips mounted adjacently on the PCB and arranged so as to emit laser light through the lenses.