Patents Assigned to VLSI Packaging Materials
  • Low temperature sealing glass compositions
    Patent number: 5188990
    Abstract: Low temperature sealing glass compositions comprising 35 to 80% by weight TeO.sub.2, 15 to 50% V.sub.2 O.sub.5 and 0.1 to 20% Nb.sub.2 O.sub.5, ZrO.sub.2 and/or ZnO.
    Type: Grant
    Filed: November 21, 1991
    Date of Patent: February 23, 1993
    Assignee: VLSI Packaging Materials
    Inventors: Maurice E. Dumesnil, Leo Finkelstein