Patents Assigned to VoidForm Products, LLC
  • Modular void form structure
    Patent number: 12163345
    Abstract: A void form is composed of molded pulp and includes bottom-facing openings. Fresh concrete placed on top of a substrate material covering the void form structure is formed with a void space underneath that allows soil to expand.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: December 10, 2024
    Assignee: VoidForm Products, LLC
    Inventors: John Woodson Gates, Todd Andrew Diehl
  • Connector
    Patent number: D942246
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: February 1, 2022
    Assignee: VoidForm Products, LLC
    Inventor: Todd Diehl
  • Stacking pin
    Patent number: D988854
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: June 13, 2023
    Assignee: Voidform Products, LLC
    Inventor: Todd Diehl
  • Spacer bracket
    Patent number: D1053698
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: December 10, 2024
    Assignee: VoidForm Products, LLC
    Inventor: Todd Diehl