Abstract: An apparatus comprising a plurality of processors coupled with a plurality of interconnects, e.g., sets of principle and redundant interconnects, to transmit/receive signals between the plurality of processors using one or more encoding schemes (e.g., first and second encoding schemes) based on an indication associated with the plurality of processors. The indication may manifest as a change in logic levels, e.g., first and second logic levels, where the first and second logic levels are different. The first encoding scheme signals over some but not all the sets of redundant interconnects based on the indication being the first logic level. The second encoding scheme signals over the set of principle interconnects and the set of redundant interconnects based on the indication being the second logic level, wherein the second encoding scheme is a one-hot encoding scheme.

Abstract: A multi-reticle IC structure comprising a substrate comprising a surface and an array of lithographically-patterned regions distributed on the surface, wherein ones of the lithographically-patterned regions comprise two or more domains. Each of the two or more domains comprise one of one or more metallization structure patterns and is interconnected to at least one adjacent domain by a plurality of embedded interconnects coupled to a first metallization structure pattern within the at least one adjacent domain. The plurality of embedded interconnects extends laterally between adjacent domains of the two or more domains.

Abstract: A wafer-level assembly of chiplets comprising a plurality of groups of chiplets including a first group of chiplets and a second group of chiplets, wherein the first group of chiplets is organized as a first fully-connected configuration, wherein the second group of chiplets is organized as a second fully-connected configuration. The wafer-level assembly of chiplets further comprises a plurality of interconnects including a first interconnect and a second interconnect, wherein the first interconnect couples a first chiplet of the first group of chiplets with a first chiplet of the second group of chiplets, wherein the second interconnect couples a second chiplet of the first group of chiplets with a second chiplet of the second group of chiplets, and wherein the plurality of interconnects is arranged in a mesh configuration.