Patents Assigned to Vonia Corporation
  • Patent number: 8447061
    Abstract: Disclosed is an earphone set using both bone conduction and air conduction. The earphone set includes: a dual earphone which allows a user to selectively hear sounds from the front or rear side of the earphone set; a case cover provided at an end of the dual earphone; a cylindrical reinforcing frame assembled on one side of the case cover; a finishing ring mounted on the outer peripheral surface of the cylindrical reinforcing frame; a top cover assembled on one side of the cylindrical reinforcing frame and the finishing ring and having an extension projection at one side thereof; a rubber ear cap assembled at a front end of the extension projection to be inserted into an ear hole of a user; and a bone conduction vibrator provided inside the dual earphone.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: May 21, 2013
    Assignee: Vonia Corporation
    Inventor: Sang Chul Lee
  • Publication number: 20120020501
    Abstract: Disclosed is an earphone set using both bone conduction and air conduction. The earphone set includes: a dual earphone which allows a user to selectively hear sounds from the front or rear side of the earphone set; a case cover provided at an end of the dual earphone; a cylindrical reinforcing frame assembled on one side of the case cover; a finishing ring mounted on the outer peripheral surface of the cylindrical reinforcing frame; a top cover assembled on one side of the cylindrical reinforcing frame and the finishing ring and having an extension projection at one side thereof; a rubber ear cap assembled at a front end of the extension projection to be inserted into an ear hole of a user; and a bone conduction vibrator provided inside the dual earphone.
    Type: Application
    Filed: May 29, 2009
    Publication date: January 26, 2012
    Applicant: Vonia Corporation
    Inventor: Sang Chul Lee