Abstract: A modular enclosure assembly comprising: an upper and lower enclosure subassemblies, interconnected by a partial interpenetration, and a pair of hinged panel subassemblies for opening/closing the inner space of the enclosure subassemblies. Each of the enclosure subassemblies incorporates a back base plate having a first interpenetrating zone, located at an end of a lower left side of the back base plate, and a second interpenetrating zone, located at an end of a lower right side of the back base plate and juxtaposed with the first interpenetrating zone. The second interpenetrating zone incorporates a slat partially superposed on a rear surface of the back base plate where and with which this second interpenetrating zone forms a monoblock structure and from which the slat extends downwardly, beyond the rear surface of the back base plate.