Abstract: Methods and systems to improve printed electrical components and for integration in circuits are disclosed. Passive components, e.g., capacitors, resistors and inductors, can be printed directly into a solid ceramic block using additive manufacturing. A grounded conductive plane or a conductive cage may be placed between adjacent electrical components, or around each component, to minimize unwanted parasitic effects in the circuits, such as, e.g., parasitic capacitance or parasitic inductance. Resistors may be printed in non-traditional shapes, for example, S-shape, smooth S-shape, U-shape, V-shape, Z-shape, zigzag-shape, and any other acceptable alternative configurations. The flexibility in shapes and sizes of the printed resistors allows optimal space usage of the ceramic block. The present invention also discloses an electrical component comprising combined predetermined values of capacitance, resistance and inductance.

Abstract: Methods and systems to improve printed electrical components and for integration in circuits are disclosed. Passive components, e.g., capacitors, resistors and inductors, can be printed directly into a solid ceramic block using additive manufacturing. A grounded conductive plane or a conductive cage may be placed between adjacent electrical components, or around each component, to minimize unwanted parasitic effects in the circuits, such as, e.g., parasitic capacitance or parasitic inductance. Resistors may be printed in non-traditional shapes, for example, S-shape, smooth S-shape, U-shape, V-shape, Z-shape, zigzag-shape, and any other acceptable alternative configurations. The flexibility in shapes and sizes of the printed resistors allows optimal space usage of the ceramic block. The present invention also discloses an electrical component comprising combined predetermined values of capacitance, resistance and inductance.

Abstract: Methods and systems to improve a multilayer ceramic capacitor using additive manufacturing are disclosed. Conductive layers and termination caps comprising a base metal may be cladded with a noble metal to lower costs without the tendency of base metal atoms combining with oxygen atoms in the dielectric material as the base metal does not physically contact the dielectric material. The conductive layers may comprise a wavy shape, and may comprise conductive layer ends modified to minimize or eliminate sharp edges and corners, such as comprising a convex, wavy, or bulbous shape. The noble metal portion of a conductive layer may be a minimum thickness required to prevent chemical reactions between the base metal portion and the dielectric material. In conjunction with computer modeling of Laplace's equation, the conductors can be reshaped at little material cost to make the electric field nearly uniform through adjustments of the base metal portion.

Abstract: Methods and systems to improve a multilayer ceramic capacitor using additive manufacturing are disclosed. Conductive layer ends and dielectric layer edges of a multilayer ceramic capacitor may be modified to comprise a round shape, which may increase voltage limits by reducing electric field intensity that results from sharp corners. Further, the capacitor may comprise wave-like structures to increase surface area of a conductive layer and/or dielectric layer. The round shape of the conductive layer end may in-part reduce the need for a wide protective gap due to its dome-shape permitting the dielectric layer to be wider on top and bottom, and thinner at the center, e.g. concave, which provides strength support to the layers. The 3D Printing process permits the distance between the conductive layer end of the conductive layer to be much closer to the dielectric layer edge of the dielectric layer, such as below the standard 500 microns.

Abstract: Methods and systems to improve a multilayer ceramic capacitor using additive manufacturing are disclosed. Conductive layer ends of a multilayer ceramic capacitor may be modified to comprise a round shape, which may increase structural stability of the capacitor's layers. Other configurations may be possible, such as bulbous or wavy shaped conductive layer ends. The layers may comprise one or more pillars made from dielectric material, e.g., barium titanate, disposed through a portion of a conductive layer. The dielectric material may be the same material used in the insulator layers of the capacitor. Each pillar may comprise a plurality of spot connections surrounding its perimeter. The embedded pillars may be used to prevent delamination of the layers and to increase mechanical strength. Additionally, an algorithm of a computing device may determine an optimal shape, size, and/or configuration of the capacitor based on one or more predetermined specifications or properties.

Abstract: Methods and systems to improve a multilayer ceramic capacitor using additive manufacturing are disclosed. Layers of a capacitor may be modified from its traditional planar shape to a wavy structure. The wavy shape increases surface area within a fixed volume of the capacitor, thus increasing capacitance, and may comprise smooth and repetitive oscillations without the presence of voltage-degrading sharp corners. In addition, the ends of each conductive layer do not have sharp edges, such as comprising of a round corner. The one-dimensional wave pattern may run parallel to the width of the capacitor, or it may align in parallel to the length of the capacitor. In some embodiments, the wave pattern may be parallel to both the width and the length—in two dimensions—such that it forms an egg-crate shape. Further, the wavy structures may comprise of secondary or tertiary wavy structures to further increase surface area.