Patents Assigned to W. C. Heraeus GmbH
  • Patent number: 9014816
    Abstract: A medical lead includes a first wire coil having an outer diameter and a marker coil having an inner diameter. The marker coil is assembled over the first wire coil. The outer diameter first wire coil is smaller than the inner diameter of the marker coil thereby defining a gap. A second wire coil substantially fills the gap between the first wire coil and the marker coil. A ball weld is formed at an end of the medical lead adjacent each of the first and second wire coils and adjacent the marker coil.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: April 21, 2015
    Assignee: W. C. Heraeus GmbH
    Inventors: Jacob E. Markham, John W. Warling, Victoria K. Sandberg
  • Patent number: 8636825
    Abstract: One aspect relates to a method for producing an alloy characterized by grinding tantalum to form a tantalum powder and grinding tungsten to form a tungsten powder; mixing the tantalum powder and the tungsten powder to form a blended powder. The weight fraction of tungsten powder in the blended powder is larger than in the desired alloy. A blended body is produced from the blended powder by a powder metallurgical route. A pre-alloy is produced by a first melting of the blended body and at least a fraction of at least one further metal by a melt metallurgical route. The alloy is produced by a second melting of the pre-alloy and the remaining fraction of at least one metal by a melt metallurgical route.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: January 28, 2014
    Assignee: W. C. Heraeus GmbH
    Inventors: Herwig Schiefer, Christoph Vogt, Heiko Specht, Jens Troetzschel, Egbert Stiedl
  • Patent number: 8606370
    Abstract: One aspect is a medical electrode system including a conduction coil and a stimulation electrode. The stimulation electrode encompasses a base body having a top area and an end area. The system is characterized in that the conduction coil encompasses a connection element. The connection element is thermally shrink-fitted onto the end area.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: December 10, 2013
    Assignee: W. C. Heraeus GmbH
    Inventors: Christoph Vogt, Lena Lewandrowski, Stefan Schibli, Christiane Leitold, René Richter
  • Patent number: 8594808
    Abstract: One aspect relates to a stimulation electrode including an electrically conducting base body. The base body encompasses tantalum and is at least partially covered with a porous tantalum oxide layer, which is anodically applied by means of high voltage pulses. Provision is made according to an embodiment for a metallic protective layer to cover the porous tantalum oxide layer so as to prevent a hydrogen embrittlement.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: November 26, 2013
    Assignee: W. C. Heraeus GmbH
    Inventors: Heiko Specht, Frank Krüger, Ulrich Hausch, Andreas Reisinger
  • Patent number: 8569625
    Abstract: A wire includes a first wire segment having an end portion and a second wire segment having an end portion. A coupling segment is adjacent the end portions of the first and second wire segments. The coupling segment is configured with a plurality of indents penetrating into at least one of the first and second wire segments.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: October 29, 2013
    Assignee: W. C. Heraeus GmbH
    Inventors: Todd W. Slininger, John W. Warling
  • Patent number: 8528201
    Abstract: One aspect relates to a method for producing an electrical bushing for an implantable device, an electrical bushing, and an implantable device. The method according to one embodiment includes forming a base body from a ceramic slurry and introducing a bushing conductor made of a metal powder, metal slurry, cermet powder and/or cermet slurry into the base body. The metal fraction in the bushing conductor is provided to decrease towards the base body. It includes sintering the green blank that includes the base body and the bushing conductor.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: September 10, 2013
    Assignee: W. C. Heraeus GmbH
    Inventors: Jens Troetzschel, Goran Pavlovic, Harald Manhardt, Nicole Guebler
  • Patent number: 8494635
    Abstract: One aspect relates to a method for producing an electrical bushing for an implantable device, a corresponding electrical bushing, and a corresponding implantable device. The method according to one embodiment is characterized in that a green blank is produced and sintered from an electrically insulating base body green blank made of a ceramic slurry or powder and at least one electrically conductive bushing body green blank made of a cermet material. The at least one bushing body green blank is inserted into a bushing opening of the base body green blank to form a composite green blank, a shape of the at least one bushing body green blank and a shape of the at least one bushing opening are complementary to each other at least in sections thereof and prevent slippage of the bushing body green blank through the bushing opening. The composite green blank is sintered while applying a force that keeps the bodies together.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: July 23, 2013
    Assignee: W. C. Heraeus GmbH
    Inventors: Jens Troetzschel, Goran Pavlovic, Harald Manhardt, Norbert Wollenberg, Nicole Guebler
  • Publication number: 20130153542
    Abstract: A method of forming a wire includes providing a first wire segment and a second wire segment. The first and second wire segments are inserted into opposite ends of a coupling segment. The coupling segment is laser welded such that the laser creates an indent in the coupling segment that penetrates into at least one of the first and second wire segments.
    Type: Application
    Filed: January 31, 2013
    Publication date: June 20, 2013
    Applicant: W. C. HERAEUS GMBH
    Inventor: W. C. Heraeus GmbH
  • Patent number: 8414679
    Abstract: One aspect is a method for producing an alloy, whereby the alloy includes at least a first metal and a second metal, whereby firstly a powder metallurgical route and subsequently a melt metallurgical route is used sequentially in order to generate the alloy from the, at least, first metal and the second metal. The method includes grinding the first metal into a first metal powder, grinding the second metal into a second metal powder, mixing the first metal powder and the second metal powder to produce a blended powder, generating a blended body from the blended powder by the powder metallurgical route, and generating the alloy by melting the blended body by the melt metallurgical route.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: April 9, 2013
    Assignee: W. C. Heraeus GmbH
    Inventors: Herwig Schiefer, Christoph Vogt, Heiko Specht, Jens Troetzschel
  • Patent number: 8399529
    Abstract: For processing of noble metal-containing, moist recycling materials with an unknown noble metal content (hereinafter called “batch”), a moisture-binding agent is added for homogenisation and the batch is mixed with comminution of optionally pre-sent agglomerates to form a free-flowing and homogenous powder. Optionally, the following takes place subsequently for analysis: A at least one representative, volume-reduced sample is taken first of all, B the sample is dried, C the sample is optionally divided further and D the sample is analyzed and the noble metal content of the batch is calculated on the basis of the data a previously known or pre-calculated quantity of the moisture-binding agent being added before sampling (step A).
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: March 19, 2013
    Assignee: W.C. Heraeus GmbH
    Inventors: Christian Mock, Horst Meyer, Matthias Grehl, Jochen Schleβmann, Martin Stettner
  • Patent number: 8394170
    Abstract: One aspect is a method for producing an alloy, whereby the alloy consists of a first metal, a second metal, a third metal, and a fourth metal, and the first metal, the second metal, the third metal, and the fourth metal are selected from the group consisting of the metals, niobium, zirconium, tantalum tungsten. The method includes the steps of grinding the first metal to form a first metal powder and grinding the second metal to form a second metal powder; mixing the first metal powder and the second metal powder to form a first blended powder; generating a first blended body from the blended powder by a powder metallurgical route; and generating the alloy by melting the first blended body and the remaining metals by a melt metallurgical route.
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: March 12, 2013
    Assignee: W. C. Heraeus GmbH
    Inventors: Herwig Schiefer, Christoph Vogt, Heiko Specht, Jens Troetzschel
  • Patent number: 8252252
    Abstract: Processes for the recovery of ruthenium from materials containing ruthenium or ruthenium oxides or from ruthenium-containing noble metal ore concentrates, with the steps of A. the introduction of the material into a highly alkaline alkali hydroxide melt in the presence of nitrate as oxidizing agent with the formation of an oxidized melt residue with water-soluble ruthenate (RuO4)2?, B. the dissolution of the oxidized melt residue obtained in water, C. the addition of a reducing agent, D. the precipitation of the metals formed, can also be used for separating off selenium. Optionally, ruthenium is separated off by distillation, instead of precipitation, following step B, with the steps of 5C the treatment of the ruthenate-containing solution with an oxidizing agent, 5D distilling off of the RuO4 obtained, 5E taking up of the RuO4 from step 5D in hydrochloric acid. By way of further subsequent purification steps, processes for the recovery of ruthenium targets are obtained.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: August 28, 2012
    Assignee: W.C. Heraeus GmbH
    Inventors: Horst Meyer, Matthias Grehl, Christian Nowottny, Martin Stettner, Joachim Kralik
  • Patent number: 8250844
    Abstract: A cable includes a first layer of wire helically wound to define a lumen having a lumen diameter. A second layer of wire is helically wound over the first layer. A first end segment of the second layer is configured with a plurality of strands that are fused together. A second end segment of the second layer is configured with a plurality of strands that are fused together.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: August 28, 2012
    Assignee: W. C. Heraeus GmbH
    Inventor: Jacob E. Markham
  • Publication number: 20120089213
    Abstract: A medical lead includes a first wire coil having an outer diameter and a marker coil having an inner diameter. The marker coil is assembled over the first wire coil. The outer diameter first wire coil is smaller than the inner diameter of the marker coil thereby defining a gap. A second wire coil substantially fills the gap between the first wire coil and the marker coil. A ball weld is formed at an end of the medical lead adjacent each of the first and second wire coils and adjacent the marker coil.
    Type: Application
    Filed: October 7, 2010
    Publication date: April 12, 2012
    Applicant: W. C. HERAEUS GMBH
    Inventors: Jacob E. Markham, John W. Warling, Victoria K. Sandberg
  • Patent number: 8153232
    Abstract: A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: April 10, 2012
    Assignee: W.C. Heraeus GmbH
    Inventors: Eckhard Ditzel, Siegfried Walter, Manfred Gresch
  • Patent number: 8137518
    Abstract: A sputter target has a carrier body and a target material arranged on the carrier body, wherein the carrier body has a rear surface facing away from the target material and the target material has a front surface facing away from the carrier body. A ferromagnetic material is arranged between the front surface and the rear surface.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: March 20, 2012
    Assignee: W.C. Heraeus GmbH
    Inventors: Hans-Joachim Pavel, Josef Heindel
  • Publication number: 20120058043
    Abstract: In processes for removing ruthenium by distilling RuO4 from ruthenate-containing solutions with these steps of the treatment of the ruthenate-containing solution with an oxidising agent, distilling off of the RuO4 formed, absorbing the RuO4 from step II in hydrochloric acid, the oxidising agent is recycled into step I following step III. The processes can be carried out in reactor modules with A a reactor with a stirrer, gas inlet and gas outlet, B at least one scrubber connected in series downstream with the gas outlet via a line, C one or several gas absorbers connected in series downstream with the at least one scrubber via lines, E at least one line from the optionally last absorber for recycling into the gas inlet of the reactor or into a further module or into a facility for off-gas treatment.
    Type: Application
    Filed: November 14, 2011
    Publication date: March 8, 2012
    Applicant: W.C. HERAEUS GMBH
    Inventors: HORST MEYER, MATTHIAS GREHL, HANS-JOACHIM ALT, PETER PATZELT, HERMANN VON EIFF, BERND ZELL
  • Patent number: 8117817
    Abstract: A cable includes a first layer of wire helically wound to define a lumen having a lumen diameter. A second layer of wire is helically wound over the first layer. A first end segment of the second layer is configured with a plurality of strands that are fused together. A second end segment of the second layer is configured with a plurality of strands that are fused together.
    Type: Grant
    Filed: October 9, 2008
    Date of Patent: February 21, 2012
    Assignee: W. C. Heraeus GmbH
    Inventors: Jacob E. Markham, Richard W. Koniszczuk
  • Publication number: 20110308957
    Abstract: One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold.
    Type: Application
    Filed: June 20, 2011
    Publication date: December 22, 2011
    Applicant: W. C. HERAEUS GMBH
    Inventors: Heiko Specht, Andreas Reisinger, Ulrich Hausch, Frank Krueger, Jens Troetzschel
  • Publication number: 20110293866
    Abstract: One aspect relates to a method for connecting a housing of an active implantable medical device to a head part, whereby an uncured joining agent that is arranged, at least in part, between the housing and the head part is transitioned into a cured joining agent to attain a firmly bonded connection. In one embodiment, the uncured joining agent includes monomers of a (meth)acrylic acid alkyl ester, and the cured joining agent includes at least one polymer of the (meth)acrylic acid alkyl ester.
    Type: Application
    Filed: May 25, 2011
    Publication date: December 1, 2011
    Applicant: W.C. Heraeus GmbH
    Inventors: Heiko Specht, Andreas Reisinger, Klaus Ruppert, Alfred Hohmann