Abstract: To permit flexibility in chemical testing steps, a plurality of automatic chemical apparatus units are arranged in modular form, each unit including a main sample receptacle transport conveyor to move the receptacle holding a sample to be tested in a main transport path, a plurality of test and treatment containers being associated with each unit, and a sampling transfer station is located to extract a sample of test substance from the sample receptacle and introduce it into one of the test and treatment containers, which test and treatment container is then moved in a separate test and treatment conveyor path along a plurality of testing and treatment stations until the entire analysis of the removed sample is completed, at which time a new sample receptacle is moved along the main path to the sampling transfer station for introducing a new sample into a subsequent test and treatment receptacle.
Type:
Grant
Filed:
July 16, 1976
Date of Patent:
August 2, 1977
Assignee:
W. C. Heraeus GmbH
Inventors:
Walter Keller, Hubert Koukol, Werner Ptaschek, Dieter Wendt
Abstract: On an aluminum oxide or high-alumina ceramic substrate an intermediate layer of a rare earth, titanium or iron oxide or a mixture of such oxides is provided for matching the thermal expansion coefficient of the substrate to that of a platinum layer between 0.1 and 10 .mu. m thick applied in a resistor pattern configuration on the surface of the intermediate layer. The intermediate layer, unlike a glass embedding layer, allows heat treatment of the platinum layer by heating the entire structure makes it possible to avoid the embedding to heal local defects, without impairing the integrity of the structure (which occur when glass melt) and without co-crystallizing with aluminum oxide. The platinum layer thickness is consistent with stability of the specific resistance and the temperature coefficient of resistance.
Abstract: To improve the bonding layer for connecting wires to semiconductor chips with contact fingers, or contact strips, on the carrier, the bonding layer is formed as spongy, microporous structure, applied to discrete positions of the contact strips by screen printing, and secured to the metallic connecting strip by a diffusion zone. Preferably, the bonding layer comprises a metal of gold, palladium, silver, aluminum and copper, or an alloy of at least two of these metals, or a base alloy of one of those metals, for example gold applied as a gold paste having an average grain size of less than 5 micrometers, the layer being between 2 to 30 micrometers thick, preferably 3 to 10 micrometers.
Type:
Grant
Filed:
March 20, 1975
Date of Patent:
May 31, 1977
Assignee:
W. C. Heraeus GmbH
Inventors:
Franz Kummer, Gerhard Mai, Rolf Ruthardt, Horst Thiede
Abstract: A valve ahead of a continuously running exhaust pump allows air to be sucked through the piping of a burette from the intake capillary and, after the capillary is lowered into the input sample vessel, a quantity of the sample liquid flushes out any remaining traces of a previous sample. After the necessary small quantity of the sample liquid has been thus pulled into and out of the burette, the valve is closed and a piston with a conical head fitting right into the burette draws in a measured quantity of the sample from the input container and then discharges it into the output container. The vertex of the piston is flattened so that the channel through the burette head will not be closed off when the piston is driven all the way into the burette head.