Patents Assigned to W. C. Hereaus GmbH
  • Patent number: 8487210
    Abstract: A wire includes a first wire section is of a first material and a second wire section is of a second material different from the first material. A joining section is adjacent both the first and second wire sections, the joining section comprising a first end and a second end. The first end of the joining section is of a material that is compatible with the first material of the first wire section and the second end of the joining section is of a material that is compatible with the second material of the second wire section.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: July 16, 2013
    Assignee: W. C. Hereaus GmbH
    Inventors: Heiko Specht, Andreas Reisinger, Goran Pavlovic, Jacob Markham, Kelly Stichter, Laurent Bataillard
  • Patent number: 6355363
    Abstract: A support structure is provided for holding open lumina, the support structure having a stainless steel substrate and a platinum layer forming the surface of the structure. The structure has at least one gold layer arranged between the substrate and the platinum layer. The platinum layer is preferably applied with a pulsed current with current reversal, in order to avoid or reduce brittleness occurring by absorption of hydrogen during galvanic deposition of platinum. Such a support structure (stent) substantially withstands the high mechanical stresses, particularly bending and torsional forces that occur during application, without the formation of significant tears in the platinum layer.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: March 12, 2002
    Assignee: W. C. Hereaus GmbH & Co. KG
    Inventors: Günter Herklotz, Frank Krüger, Thomas Frey, Thomas Giesel