Abstract: Crystalline rods or blocks can be sawed into thin wafers by sawing the rod or block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed with a two-blade internal-hole saw.
Type:
Grant
Filed:
April 8, 1985
Date of Patent:
January 6, 1987
Assignee:
Wacker-Chemie Gesellschaft fur Elektronik-Grundstoffe mbH
Inventors:
Gunter Lossl, Helmut Zauhar, Horst Stock