Patents Assigned to Wacker-Chemie Gesellschaft fur Elektronik-Grundstoffe mbH
  • Patent number: 4633847
    Abstract: Crystalline rods or blocks can be sawed into thin wafers by sawing the rod or block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed with a two-blade internal-hole saw.
    Type: Grant
    Filed: April 8, 1985
    Date of Patent: January 6, 1987
    Assignee: Wacker-Chemie Gesellschaft fur Elektronik-Grundstoffe mbH
    Inventors: Gunter Lossl, Helmut Zauhar, Horst Stock