Abstract: A process for preserving the surface of silicon wafers after the wafers are polished in a conventional polishing operation by converting the wafer surface to the hydrophobic state, in particular, by polishing, or with hydrofluoric acid and treating immediately afterwards with a reagent, e.g., alcohols, organosilanes or silanols and preferably in aqueous solution. The wafer becomes coated in this process with a protective layer which inhibits surface deterioration, and also permits long storage times.
Type:
Grant
Filed:
June 20, 1989
Date of Patent:
November 27, 1990
Assignee:
Wacker Chemitronic Gesellschaft
Inventors:
Helene Prigge, Anton Schnegg, Gerhard Brehm
Abstract: An induction heating coil for a zone pulling of semiconductor rods assures the disturbance-free performance of the pulling process even at the high power densities required for large rod diameters (approximately 10 to 12 cm). According to the invention, the arc-over paths between surfaces in the region of the coil slot, which are at differing potentials, are covered by one or more movable planar structures of temperature-stable insulating material which are introduced into the coil slot.