Abstract: A method to be used for adjusting the radial deviation from the true runn position of the internal cutting edge of annular saw blades and an apparatus for carrying out the method. For this purpose, the radial deviation or out-of-true is first measured as a function of position. Subsequently, the saw blade is stretched as a function of position in a defined manner in order to compensate for the deviations from the specified value of the radial out-of-true as a function of position. The measuring and tensioning cycles are continued until the deviation from the specified value no longer exceeds a predetermined tolerance limit. Saw blades adjusted in this manner are characterized by long service lives and high cutting accuracy.

Abstract: A process is provided for bilateral abrasive machining of wafer-like workpieces, especially semiconductor wafers. The process uses carrier disks in which the outer periphery on which the driving forces mesh, is made of a material having a tensile strength of at least 100 N/mm.sup.2, while in the area that comes into contact with the workpieces to be machined, there is provided a plastic material having an elasticity modulus of from 1.0 to 8.10.sup.4 N/mm.sup.2.