Patents Assigned to Wacker Chemitronics GmbH
  • Process for sharpening cutting-off tools and cutting-off process
    Patent number: 4811722
    Abstract: Cutting-off tools whose cutting edge has a cutting layer with a bonded cutting grain are sharpened by sawing momentarily into a solid sharpening substance, in which case, in addition to a relative movement between cutting edge and solid material corresponding to the sawing operation, an oscillating relative movement transversely thereto is also performed. The process is used with particular advantage in combination with processes for the centerhole sawing of semiconductor or oxidic material.
    Type: Grant
    Filed: May 5, 1988
    Date of Patent: March 14, 1989
    Assignee: Wacker Chemitronics GmbH
    Inventors: Gerhard Brehm, Johann Niedermeier