Abstract: A process for reclaiming a suspension which is produced during the machining of semiconductor material and which contains a liquid, a substance with an abrasive action and abraded semiconductor material, includes separating off the substance with an abrasive action and then separating the liquid and the abraded material. In the process, the liquid and the abraded material are separated with the aid of a magnetic separator.
Type:
Grant
Filed:
March 16, 2000
Date of Patent:
July 24, 2001
Assignee:
Wacker Siltronic Gesellschaft für Halbleitrmaterialien
AG