Patents Assigned to Wacker Siltronic Gesellschaft für Halbleitrmaterialien AG
  • Patent number: 6264843
    Abstract: A process for reclaiming a suspension which is produced during the machining of semiconductor material and which contains a liquid, a substance with an abrasive action and abraded semiconductor material, includes separating off the substance with an abrasive action and then separating the liquid and the abraded material. In the process, the liquid and the abraded material are separated with the aid of a magnetic separator.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: July 24, 2001
    Assignee: Wacker Siltronic Gesellschaft für Halbleitrmaterialien AG
    Inventor: Peter Wiesner