Patents Assigned to WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALEN AG
  • Publication number: 20030041798
    Abstract: A silicon wafer is provided having a polished front surface with an epitaxial coating and a polished back surface, which is distinguished by a SFQRmax value of less than or equal to 0.10 &mgr;m (26 mm×8 mm; 99%). There is also a process for producing silicon wafers of this type by sawing up a single crystal, carrying out an abrasive step, simultaneously polishing a front surface and a back surface of at least three silicon wafers, and applying an epitaxial coating.
    Type: Application
    Filed: September 3, 2002
    Publication date: March 6, 2003
    Applicant: WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALEN AG
    Inventors: Guido Wenski, Ute Mareck, Thomas Altmann