Patents Assigned to WaferMasters
  • Patent number: 6911376
    Abstract: A process, which includes implanting hydrogen ions into a silicon substrate, overlaying the silicon substrate on to a support substrate, and applying a flash anneal heat treatment to the silicon and support substrates to cause the silicon substrates to separate at a region defined by the implanted hydrogen ions.
    Type: Grant
    Filed: October 1, 2003
    Date of Patent: June 28, 2005
    Assignee: WaferMasters
    Inventor: Woo Sik Yoo
  • Patent number: 6862404
    Abstract: An apparatus and method for heating substrates, such as semiconductor wafers. A radiation energy source is arranged proximate to a reflector to direct radiation towards a window providing optical access to a processing chamber. A lens positioned outside of the window focuses the radiation emitted from the radiation energy source and reflector and directs it through the window. The focused radiation energy can be used to directly or indirectly heat a semiconductor wafer disposed the processing chamber.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: March 1, 2005
    Assignee: WaferMasters
    Inventor: Woo Sik Yoo