Patents Assigned to WaferYield, Inc.
  • Optimization of die placement on wafers
    Publication number: 20030212966
    Abstract: A method of optimizing production of semiconductor devices on a wafer comprises steps of characterizing at least one effect of at least one manufacturing component on at least one optimization criterion; inputting user optimization data; and, based on the at least one effect and the user optimization data, performing optimization to determine a layout of semiconductor devices on the wafer that optimizes performance according to the user optimization data.
    Type: Application
    Filed: May 2, 2003
    Publication date: November 13, 2003
    Applicant: WaferYield, Inc.
    Inventor: Eitan Cadouri